Sub-connector and wafer thereof

The invention discloses a sub-connector, and the sub-connector comprises a plurality of wafers installed in parallel, wherein each wafer comprises an insulator and shielding plates installed on the two sides of the insulator, a differential pair is installed in the insulator, and the shielding plate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WU ZEDIAN, LIU CHENGYIN, ZHOU GUOQI, MA LUFEI, ZHANG SHUANG, HOU SHAOJIE, WANG ZHANYUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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