Sub-connector and wafer thereof

The invention discloses a sub-connector, and the sub-connector comprises a plurality of wafers installed in parallel, wherein each wafer comprises an insulator and shielding plates installed on the two sides of the insulator, a differential pair is installed in the insulator, and the shielding plates on the two sides are connected with conductors through the shielding plates to achieve contact conduction; the shielding plate comprises a main body part and a shielding plate extension area formed by extending the main body part towards the contact end, the two sides of the shielding plate connecting conductor are correspondingly contacted and conducted with the shielding plate extension areas on the two sides respectively, and the shielding plate connecting conductor is located between the adjacent differential pairs; therefore, a full-shielding surrounding structure is formed on the periphery of the contact end of any differential pair. By means of the technical scheme, the shielding plates are connected with