Chip packaging material, chip packaging structure and packaging method

The invention discloses a chip packaging material, which comprises epoxy resin containing naphthalene rings, and is combined with a curing agent with a specific proportion, so that the warping of the packaging material is effectively reduced, and the defect that a chip containing a copper shielding...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WU DE, LIAO SHUHANG, SU JUNXING, HU ZONGXIAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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