Chip packaging material, chip packaging structure and packaging method
The invention discloses a chip packaging material, which comprises epoxy resin containing naphthalene rings, and is combined with a curing agent with a specific proportion, so that the warping of the packaging material is effectively reduced, and the defect that a chip containing a copper shielding...
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| creator | WU DE LIAO SHUHANG SU JUNXING HU ZONGXIAO |
| description | The invention discloses a chip packaging material, which comprises epoxy resin containing naphthalene rings, and is combined with a curing agent with a specific proportion, so that the warping of the packaging material is effectively reduced, and the defect that a chip containing a copper shielding layer is easy to reversely warp due to the soft material of the copper shielding layer is obviously improved. Moreover, the silicon rubber powder with a core-shell structure is added as a toughening agent, so that the warping of the packaging material is further adjusted, the packaging material is suitable for packaging chips with different sizes and different electromagnetic shielding layer thicknesses, and the usability of the packaging material is improved. Furthermore, the invention provides a packaging structure and a packaging method of the chip containing the electromagnetic shielding layer, and the packaging structure is simple in process, can be widely applied to packaging of the chip, and has a wide appli |
| format | Patent |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | Chip packaging material, chip packaging structure and packaging method |
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