Bonding alloy silver wire and preparation method

The invention discloses a bonding alloy silver wire and a preparation method, and relates to the technical field of bonding wire processing. The bonding alloy silver wire comprises the following components in percentage by weight: 0.1-9.0 wt% of a gold sheet with the purity of 99.99 wt%, 2.5.0-7.5 wt% of a palladium sheet with the purity of 99.97 wt%, 0-0.26 wt% of an Au-Be master alloy, and 0-2.4 wt% of an Au-Ca master alloy. A motor or an air cylinder does not need to be arranged for driving, then an additional heat insulation protection mechanism does not need to be arranged, meanwhile, the situation that normal preparation of the bonding alloy silver wire is affected due to high-temperature damage of the motor or the air cylinder can be avoided, meanwhile, hot airflow generated in the heat dissipation process is fully utilized, and energy waste is avoided. 本发明公开了一种键合合金银丝及制备方法，涉及到键合丝加工技术领域，按重量百分比包含纯度为99.99wt％金片0.1-9.0wt％，纯度为99.97wt％的钯片2.5.0wt％-7.5.0wt％，Au-Be母合金0-0.26wt％，Au-Ca母合金0-2.4wt％。本发明无需设置电机或气缸进行驱动，进而