Semiconductor device and forming method thereof
A semiconductor device and a method of forming the same are provided. The method includes forming a first fin and a second fin over a substrate. The method includes forming a first dummy gate structure across the first fin and the second fin, wherein the first dummy gate structure includes a first d...
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creator | CAI YAYI ZHANG QIXIANG LIN ZHIHAN ZHANG SHUWEI GU SHUYUAN LIN SHIYAO WANG ZIZHONG |
description | A semiconductor device and a method of forming the same are provided. The method includes forming a first fin and a second fin over a substrate. The method includes forming a first dummy gate structure across the first fin and the second fin, wherein the first dummy gate structure includes a first dummy gate dielectric and a first dummy gate disposed over the first dummy gate dielectric. The method includes replacing a portion of the first dummy gate with a gate isolation structure, wherein the portion of the first dummy gate is disposed over the second fin. The method includes removing the first dummy gate. The method includes removing a first portion of the first dummy gate dielectric around the first fin while maintaining a second portion of the first dummy gate dielectric around the second fin intact. The method includes forming a gate feature across the first fin and the second fin, wherein the gate isolation structure intersects the gate feature.
提供一种半导体装置及其形成方法。方法包含在基底上方形成第一鳍状物以及第二鳍状物。方法包含形成横跨第一鳍状物以及第二 |
format | Patent |
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提供一种半导体装置及其形成方法。方法包含在基底上方形成第一鳍状物以及第二鳍状物。方法包含形成横跨第一鳍状物以及第二</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPTs3NTM7PSylNLskvUkhJLctMTlVIzEtRSMsvys3MS1fITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGxqampsZGBo7GxKgBAELgKwo</recordid><startdate>20211026</startdate><enddate>20211026</enddate><creator>CAI YAYI</creator><creator>ZHANG QIXIANG</creator><creator>LIN ZHIHAN</creator><creator>ZHANG SHUWEI</creator><creator>GU SHUYUAN</creator><creator>LIN SHIYAO</creator><creator>WANG ZIZHONG</creator><scope>EVB</scope></search><sort><creationdate>20211026</creationdate><title>Semiconductor device and forming method thereof</title><author>CAI YAYI ; ZHANG QIXIANG ; LIN ZHIHAN ; ZHANG SHUWEI ; GU SHUYUAN ; LIN SHIYAO ; WANG ZIZHONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113555320A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CAI YAYI</creatorcontrib><creatorcontrib>ZHANG QIXIANG</creatorcontrib><creatorcontrib>LIN ZHIHAN</creatorcontrib><creatorcontrib>ZHANG SHUWEI</creatorcontrib><creatorcontrib>GU SHUYUAN</creatorcontrib><creatorcontrib>LIN SHIYAO</creatorcontrib><creatorcontrib>WANG ZIZHONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAI YAYI</au><au>ZHANG QIXIANG</au><au>LIN ZHIHAN</au><au>ZHANG SHUWEI</au><au>GU SHUYUAN</au><au>LIN SHIYAO</au><au>WANG ZIZHONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device and forming method thereof</title><date>2021-10-26</date><risdate>2021</risdate><abstract>A semiconductor device and a method of forming the same are provided. The method includes forming a first fin and a second fin over a substrate. The method includes forming a first dummy gate structure across the first fin and the second fin, wherein the first dummy gate structure includes a first dummy gate dielectric and a first dummy gate disposed over the first dummy gate dielectric. The method includes replacing a portion of the first dummy gate with a gate isolation structure, wherein the portion of the first dummy gate is disposed over the second fin. The method includes removing the first dummy gate. The method includes removing a first portion of the first dummy gate dielectric around the first fin while maintaining a second portion of the first dummy gate dielectric around the second fin intact. The method includes forming a gate feature across the first fin and the second fin, wherein the gate isolation structure intersects the gate feature.
提供一种半导体装置及其形成方法。方法包含在基底上方形成第一鳍状物以及第二鳍状物。方法包含形成横跨第一鳍状物以及第二</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Semiconductor device and forming method thereof |
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