SUBSTRATE PROCESSING APPARATUS

The present invention relates to a substrate processing apparatus, and more particularly, the substrate processing apparatus includes a gas utility exhausting each of the reaction space and the protective space so that a pressure change process including a high-pressure process, which is in a state of a pressure higher than atmospheric pressure, and a low-pressure process that is in a state of a pressure lower than the atmospheric pressure, is performed on a plurality of substrates introduced into the reaction space. 本发明涉及基板处理装置，更详细地说涉及通过高压及低压执行基板处理的基板处理装置。本发明公开了一种基板处理装置，包括气体公用部，分别针对反应空间及保护空间进行排气，以针对进入反应空间的多个基板执行包括高于常压的高压工艺和低于常压的低压工艺的变压工艺。