Rapid method for detecting flatness of high-precision lead frame material for etching

The invention discloses a rapid method for detecting the flatness of a high-precision lead frame material for etching. The technological process comprises the steps of sampling, primary photoresist coating, primary drying, primary plate making, primary exposure, primary development, edge etching, ph...

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Hauptverfasser:	GUO HUIWEN, WAN JIAN, WANG MENGNA, DING SHUNDE, NIU LIYE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING
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creator	GUO HUIWEN WAN JIAN WANG MENGNA DING SHUNDE NIU LIYE
description	The invention discloses a rapid method for detecting the flatness of a high-precision lead frame material for etching. The technological process comprises the steps of sampling, primary photoresist coating, primary drying, primary plate making, primary exposure, primary development, edge etching, photoresist removing, secondary photoresist coating, secondary drying, secondary plate making, secondary exposure, secondary development, half etching or full etching, flatness measurement and flatness evaluation. According to the method, the problem of pre-judging the flatness of the etched high-precision lead frame material copper strip before the copper strip leaves a factory is solved, the steps of spraying, drying, plate making, etching and the like in the operation process are mainly realized by machines, the influence caused by human factors in the operation process is reduced, the accuracy of etching control is improved, the etching efficiency is greatly improved, and the pre-judgment of the flatness of the e
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The technological process comprises the steps of sampling, primary photoresist coating, primary drying, primary plate making, primary exposure, primary development, edge etching, photoresist removing, secondary photoresist coating, secondary drying, secondary plate making, secondary exposure, secondary development, half etching or full etching, flatness measurement and flatness evaluation. According to the method, the problem of pre-judging the flatness of the etched high-precision lead frame material copper strip before the copper strip leaves a factory is solved, the steps of spraying, drying, plate making, etching and the like in the operation process are mainly realized by machines, the influence caused by human factors in the operation process is reduced, the accuracy of etching control is improved, the etching efficiency is greatly improved, and the pre-judgment of the flatness of the e</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; TESTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211022&DB=EPODOC&CC=CN&NR=113534612A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211022&DB=EPODOC&CC=CN&NR=113534612A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUO HUIWEN</creatorcontrib><creatorcontrib>WAN JIAN</creatorcontrib><creatorcontrib>WANG MENGNA</creatorcontrib><creatorcontrib>DING SHUNDE</creatorcontrib><creatorcontrib>NIU LIYE</creatorcontrib><title>Rapid method for detecting flatness of high-precision lead frame material for etching</title><description>The invention discloses a rapid method for detecting the flatness of a high-precision lead frame material for etching. 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subjects	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING
title	Rapid method for detecting flatness of high-precision lead frame material for etching
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