Semiconductor device and forming method thereof

A method includes forming a metal seed layer over a first conductive part of a wafer; forming a patterned photoresist on the metal seed layer; forming a second conductive part in an opening of the patterned photoresist; heating the wafer to create a gap between the second conductive part and the pat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAO LONGKAI, LIN YONGSHENG, LYU WENXIONG, ZHUANG YONGHAN, KANG JINWEI, ZHENG MINGDA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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