Isolated interface integrated circuit and packaging method thereof

The invention provides an isolated interface integrated circuit and method, and belongs to the technical field of integrated circuits. The isolated interface integrated circuit comprises a digital channel primary end chip DIE1 and a power channel primary end chip DIE5 which are arranged on a first base island, a digital channel isolation device chip DIE2, a digital channel secondary end chip DIE3 and a bus interface chip DIE4 which are arranged on a second base island, and a power channel isolation device chip DIE6 and a power channel secondary end chip DIE7 which are arranged on a third base island, and the first base island, the second base island and the third base island are mutually isolated. According to the present invention, a packaging method for a multi-DIE integrated isolated interface is simple in process and low in cost, and an isolated DC-DC power source and an isolated interface chip are integrated together, so that the chip only needs to supply power at the original end, no extra power source