Ultrathin vapor chamber, preparation method thereof and electronic equipment
The invention relates to an ultrathin vapor chamber, a preparation method thereof and electronic equipment, and the vapor chamber comprises a first cover plate and a second cover plate. The first cover plate and the second cover plate are connected in a sealed mode to form a sealed cavity, a negativ...
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creator | WANG YINGXIAN DUAN LONGHUA NIE CONG TANG YONG LIU YONGLU CHEN GONG FAN DONGQIANG JIN LINFANG |
description | The invention relates to an ultrathin vapor chamber, a preparation method thereof and electronic equipment, and the vapor chamber comprises a first cover plate and a second cover plate. The first cover plate and the second cover plate are connected in a sealed mode to form a sealed cavity, a negative pressure environment is formed in the sealed cavity, a capillary structure and a cooling medium are arranged in the sealed cavity, and the inner surface of the first cover plate and/or the inner surface of the second cover plate and/or the capillary structure comprise/comprises a hydrophobic structure layer and a hydrophilic structure layer. The hydrophobic structure layer is obtained by performing surface hydrophobization treatment on the first cover plate and/or the second cover plate and/or the capillary structure after etching or deposition or film layer treatment. According to the ultrathin vapor chamber provided by the embodiment of the invention, the formation of a liquid film can be effectively prevented |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Ultrathin vapor chamber, preparation method thereof and electronic equipment |
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