LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
The invention relates to a LED structure which includes a substrate, a plurality of LED units, a bonding layer and a metal contact. The substrate includes a driving circuit, and a plurality of LED units is formed on the substrate. The bonding layer is formed between the substrate and the plurality o...
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| creator | ZHUANG YONGZHANG |
| description | The invention relates to a LED structure which includes a substrate, a plurality of LED units, a bonding layer and a metal contact. The substrate includes a driving circuit, and a plurality of LED units is formed on the substrate. The bonding layer is formed between the substrate and the plurality of LED units, and the metal contact is formed in the bonding layer beneath each LED unit to electrically connect each LED unit with a contact pad of the driving circuit. A first sectional area of the metal contact is smaller than a second sectional area of each LED unit.
本申请涉及一种LED结构，包括基板、多个LED单元、键合层和金属触点。基板包括驱动电路，并且在基板上形成多个LED单元。键合层形成在基板与多个LED单元之间，并且金属触点形成在每个LED单元下方的键合层中，以将每个LED单元与驱动电路的焊盘电连接。金属触点的第一截面面积小于每个LED单元的第二截面面积。 |
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本申请涉及一种LED结构，包括基板、多个LED单元、键合层和金属触点。基板包括驱动电路，并且在基板上形成多个LED单元。键合层形成在基板与多个LED单元之间，并且金属触点形成在每个LED单元下方的键合层中，以将每个LED单元与驱动电路的焊盘电连接。金属触点的第一截面面积小于每个LED单元的第二截面面积。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211008&DB=EPODOC&CC=CN&NR=113488576A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211008&DB=EPODOC&CC=CN&NR=113488576A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHUANG YONGZHANG</creatorcontrib><title>LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME</title><description>The invention relates to a LED structure which includes a substrate, a plurality of LED units, a bonding layer and a metal contact. The substrate includes a driving circuit, and a plurality of LED units is formed on the substrate. The bonding layer is formed between the substrate and the plurality of LED units, and the metal contact is formed in the bonding layer beneath each LED unit to electrically connect each LED unit with a contact pad of the driving circuit. A first sectional area of the metal contact is smaller than a second sectional area of each LED unit.
本申请涉及一种LED结构，包括基板、多个LED单元、键合层和金属触点。基板包括驱动电路，并且在基板上形成多个LED单元。键合层形成在基板与多个LED单元之间，并且金属触点形成在每个LED单元下方的键合层中，以将每个LED单元与驱动电路的焊盘电连接。金属触点的第一截面面积小于每个LED单元的第二截面面积。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDx8XT3CFFw9fUMCfH0c1dw8fR3cVUIDgkKdQ4JDXJVcPRzUfB1DfHwd1Fw8w9S8HX0C3VzBEmBFId4AJU6-rryMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ2MTCwtTczNHY2LUAABVKCvG</recordid><startdate>20211008</startdate><enddate>20211008</enddate><creator>ZHUANG YONGZHANG</creator><scope>EVB</scope></search><sort><creationdate>20211008</creationdate><title>LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME</title><author>ZHUANG YONGZHANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113488576A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHUANG YONGZHANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHUANG YONGZHANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME</title><date>2021-10-08</date><risdate>2021</risdate><abstract>The invention relates to a LED structure which includes a substrate, a plurality of LED units, a bonding layer and a metal contact. The substrate includes a driving circuit, and a plurality of LED units is formed on the substrate. The bonding layer is formed between the substrate and the plurality of LED units, and the metal contact is formed in the bonding layer beneath each LED unit to electrically connect each LED unit with a contact pad of the driving circuit. A first sectional area of the metal contact is smaller than a second sectional area of each LED unit.
本申请涉及一种LED结构，包括基板、多个LED单元、键合层和金属触点。基板包括驱动电路，并且在基板上形成多个LED单元。键合层形成在基板与多个LED单元之间，并且金属触点形成在每个LED单元下方的键合层中，以将每个LED单元与驱动电路的焊盘电连接。金属触点的第一截面面积小于每个LED单元的第二截面面积。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
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