Low-dielectric glass fiber reinforced PC/PPO composite material and preparation method thereof

The invention discloses a low-dielectric glass fiber reinforced PC/PPO composite material and a preparation method thereof. The raw material formula of the PC/PPO composite material consists of the following components in percentage by mass: 29.8 to 41.5 percent of polycarbonate, 29.7 to 38.0 percen...

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Hauptverfasser: YUAN YANCHAO, LIU SHUMEI, ZHU YAMING, ZHAO JIANQING, ZHONG SHAOXIN
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LIU SHUMEI
ZHU YAMING
ZHAO JIANQING
ZHONG SHAOXIN
description The invention discloses a low-dielectric glass fiber reinforced PC/PPO composite material and a preparation method thereof. The raw material formula of the PC/PPO composite material consists of the following components in percentage by mass: 29.8 to 41.5 percent of polycarbonate, 29.7 to 38.0 percent of modified polyphenyl ether, 20.0 to 40.0 percent of short cut low dielectric glass fiber, 0.1 to 0.4 percent of antioxidant and 0.3 to 0.6 percent of dispersing agent. The Dk of the composite material is reduced to 2.83-3.10, the Df is reduced to 1.53 * 10 to 2.40 * 10, the application requirements of 5G/6G on low dielectric materials can be met, and the good compatibility and the low melt viscosity ensure that the composite material has high mechanical properties and excellent molding processing properties. 本发明公开了低介电玻纤增强PC/PPO复合材料及其制备方法。按质量百分比计,PC/PPO复合材料该原料配方由如下组分组成:29.8%~41.5%的聚碳酸酯、29.7%~38.0%的改性聚苯醚、20.0%~40.0%的短切低介电玻璃纤维、0.1%~0.4%的抗氧剂、0.3%~0.6%的分散剂;本发明复合材料的Dk降低至2.83~3.10,Df降低至1.53×10-3~2.40×10-3,能够满足
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subjects AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
title Low-dielectric glass fiber reinforced PC/PPO composite material and preparation method thereof
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