Method for preventing solder resist paste from stripping in test
The invention discloses a method for preventing test stripping of solder resist paste flux, and the method comprises the following steps: carrying out the early-stage processing of a PCB workpiece, and generating a to-be-processed workpiece; treating the to-be-treated workpiece with the super-roughe...
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| creator | HE JINTIAN PENG LANGXIANG XIAO CAI |
| description | The invention discloses a method for preventing test stripping of solder resist paste flux, and the method comprises the following steps: carrying out the early-stage processing of a PCB workpiece, and generating a to-be-processed workpiece; treating the to-be-treated workpiece with the super-roughening liquid, and generating a roughened workpiece; carrying out the solder resist printing; after primary pre-baking, carrying out the exposure and development treatment, and carrying out the post-baking; coating flux paste for testing, and carrying out ultraviolet curing treatment; and checking whether the cured product meets the requirements or not: if so, carrying out later process treatment. The Tg value of printing ink can be increased after solder resist high-temperature curing, the stability, the reliability, the heat resistance and the chemical resistance of a finished PCB are improved, and the thermal expansion coefficient is reduced; meanwhile, the physical shape of the copper surface can be improved thro |
| format | Patent |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Method for preventing solder resist paste from stripping in test |
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