METHOD OF FORMING COPPER OXIDE ON A COPPER SURFACE
A method of forming copper oxide on a copper surface, the method comprising the steps a) providing a substrate comprising the copper surface, b) optionally pre-cleaning the copper surface, c) contacting the copper surface with an alkaline aqueous oxidizing solution comprising one or more than one ox...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WOOD NEAL HULSMANN THOMAS HAARMANN PHILIPP |
| description | A method of forming copper oxide on a copper surface, the method comprising the steps a) providing a substrate comprising the copper surface, b) optionally pre-cleaning the copper surface, c) contacting the copper surface with an alkaline aqueous oxidizing solution comprising one or more than one oxidizing compound selected from the group consisting of - an aromatic sulfonic acid compound, salts thereof, - an aromatic sulfonic acid ester compound, salts thereof, - an aromatic nitro compound, and salts thereof, such that said copper oxide is formed on the copper surface.
一种在铜表面形成氧化铜的方法，所述方法包括以下步骤：a)提供包括所述铜表面的衬底，b)任选地预清洁所述铜表面，c)使所述铜表面与碱性水性氧化溶液接触以在所述铜表面上形成所述氧化铜，所述碱性水性氧化溶液包括一种或多于一种选自由以下组成的群组的氧化化合物：-芳香族磺酸化合物、其盐，-芳香族磺酸酯化合物、其盐，-芳香族硝基化合物及其盐。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113316663A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113316663A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113316663A3</originalsourceid><addsrcrecordid>eNrjZDDydQ3x8HdR8HdTcPMP8vX0c1dw9g8IcA1S8I_wdHFV8PdTcISJBIcGuTk6u_IwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NDY2NDMzMzY0djYtQAAE-3Jm8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF FORMING COPPER OXIDE ON A COPPER SURFACE</title><source>esp@cenet</source><creator>WOOD NEAL ; HULSMANN THOMAS ; HAARMANN PHILIPP</creator><creatorcontrib>WOOD NEAL ; HULSMANN THOMAS ; HAARMANN PHILIPP</creatorcontrib><description>A method of forming copper oxide on a copper surface, the method comprising the steps a) providing a substrate comprising the copper surface, b) optionally pre-cleaning the copper surface, c) contacting the copper surface with an alkaline aqueous oxidizing solution comprising one or more than one oxidizing compound selected from the group consisting of - an aromatic sulfonic acid compound, salts thereof, - an aromatic sulfonic acid ester compound, salts thereof, - an aromatic nitro compound, and salts thereof, such that said copper oxide is formed on the copper surface.
一种在铜表面形成氧化铜的方法，所述方法包括以下步骤：a)提供包括所述铜表面的衬底，b)任选地预清洁所述铜表面，c)使所述铜表面与碱性水性氧化溶液接触以在所述铜表面上形成所述氧化铜，所述碱性水性氧化溶液包括一种或多于一种选自由以下组成的群组的氧化化合物：-芳香族磺酸化合物、其盐，-芳香族磺酸酯化合物、其盐，-芳香族硝基化合物及其盐。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210827&DB=EPODOC&CC=CN&NR=113316663A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210827&DB=EPODOC&CC=CN&NR=113316663A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WOOD NEAL</creatorcontrib><creatorcontrib>HULSMANN THOMAS</creatorcontrib><creatorcontrib>HAARMANN PHILIPP</creatorcontrib><title>METHOD OF FORMING COPPER OXIDE ON A COPPER SURFACE</title><description>A method of forming copper oxide on a copper surface, the method comprising the steps a) providing a substrate comprising the copper surface, b) optionally pre-cleaning the copper surface, c) contacting the copper surface with an alkaline aqueous oxidizing solution comprising one or more than one oxidizing compound selected from the group consisting of - an aromatic sulfonic acid compound, salts thereof, - an aromatic sulfonic acid ester compound, salts thereof, - an aromatic nitro compound, and salts thereof, such that said copper oxide is formed on the copper surface.
一种在铜表面形成氧化铜的方法，所述方法包括以下步骤：a)提供包括所述铜表面的衬底，b)任选地预清洁所述铜表面，c)使所述铜表面与碱性水性氧化溶液接触以在所述铜表面上形成所述氧化铜，所述碱性水性氧化溶液包括一种或多于一种选自由以下组成的群组的氧化化合物：-芳香族磺酸化合物、其盐，-芳香族磺酸酯化合物、其盐，-芳香族硝基化合物及其盐。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDydQ3x8HdR8HdTcPMP8vX0c1dw9g8IcA1S8I_wdHFV8PdTcISJBIcGuTk6u_IwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NDY2NDMzMzY0djYtQAAE-3Jm8</recordid><startdate>20210827</startdate><enddate>20210827</enddate><creator>WOOD NEAL</creator><creator>HULSMANN THOMAS</creator><creator>HAARMANN PHILIPP</creator><scope>EVB</scope></search><sort><creationdate>20210827</creationdate><title>METHOD OF FORMING COPPER OXIDE ON A COPPER SURFACE</title><author>WOOD NEAL ; HULSMANN THOMAS ; HAARMANN PHILIPP</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113316663A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>WOOD NEAL</creatorcontrib><creatorcontrib>HULSMANN THOMAS</creatorcontrib><creatorcontrib>HAARMANN PHILIPP</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WOOD NEAL</au><au>HULSMANN THOMAS</au><au>HAARMANN PHILIPP</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF FORMING COPPER OXIDE ON A COPPER SURFACE</title><date>2021-08-27</date><risdate>2021</risdate><abstract>A method of forming copper oxide on a copper surface, the method comprising the steps a) providing a substrate comprising the copper surface, b) optionally pre-cleaning the copper surface, c) contacting the copper surface with an alkaline aqueous oxidizing solution comprising one or more than one oxidizing compound selected from the group consisting of - an aromatic sulfonic acid compound, salts thereof, - an aromatic sulfonic acid ester compound, salts thereof, - an aromatic nitro compound, and salts thereof, such that said copper oxide is formed on the copper surface.
一种在铜表面形成氧化铜的方法，所述方法包括以下步骤：a)提供包括所述铜表面的衬底，b)任选地预清洁所述铜表面，c)使所述铜表面与碱性水性氧化溶液接触以在所述铜表面上形成所述氧化铜，所述碱性水性氧化溶液包括一种或多于一种选自由以下组成的群组的氧化化合物：-芳香族磺酸化合物、其盐，-芳香族磺酸酯化合物、其盐，-芳香族硝基化合物及其盐。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN113316663A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | METHOD OF FORMING COPPER OXIDE ON A COPPER SURFACE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T20%3A41%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WOOD%20NEAL&rft.date=2021-08-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN113316663A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |