Intelligent process applied to circuit board chemical thick copper deposition

The invention relates to the technical field of circuit board copper deposition processes, in particular to an intelligent chemical thick copper deposition process applied to a circuit board. The method comprises the following steps: 1) manufacturing an inner-layer circuit, cutting a circuit board raw material according to a circuit board production process in the prior art to obtain a substrate, then transferring and etching an inner-layer pattern on the substrate, and forming the inner-layer circuit on the substrate to obtain an inner-layer board; 2) performing inner layer lamination manufacturing, specifically, enabling the inner layer plate obtained in the step (1) to be subjected to lamination treatment, and forming a first multi-layer inner layer plate; 3) performing drilling, specifically, drilling blind holes through laser, mechanically drilling through holes, and drilling the needed blind holes and the needed through holes in the first multi-layer inner layer plate; 4) copper plating; 5) manufacturin