ESTIMATING THE TEMPERATURE OF A MEMORY SUB-SYSTEM

A request for an estimated temperature of a memory sub-system including multiple components can be received. A set of component temperature values based on temperature measurements at the components can be identified. A subset of the component temperature values can be generated by removing one or m...

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Bibliographische Detailangaben
Hauptverfasser: HOLMSTROM DAVID A, AKIN WILLIAM, YANG JUI-YAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A request for an estimated temperature of a memory sub-system including multiple components can be received. A set of component temperature values based on temperature measurements at the components can be identified. A subset of the component temperature values can be generated by removing one or more of the component temperature values from the set of component temperature values based on one or more criteria. The estimated temperature value that estimates the temperature of the memory sub-system can be generated using the subset of the component temperature values. 可接收对包含多个组件的存储器子系统的估计温度的请求。可基于所述组件处的温度测量来识别组件温度值的集合。可通过基于一或多个标准从所述组件温度值的所述集合中移除一或多个所述组件温度值来生成所述组件温度值的子集。可使用所述组件温度值的所述子集来生成估计所述存储器子系统的温度的估计温度值。