METHOD FOR CONTROLLING MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES
Disclosed is a method for determining a correction relating to a performance metric of a semiconductor manufacturing process. The method comprises obtaining a first set of pre-process metrology data; processing the first set of pre-process metrology data by decomposing the pre-process metrology data...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ZHANG YOUPING HASTINGS SIMON PHILIP SPENCER BRANTJES NICOLAAS PETRUS MARCUS LIN CHENXI CHENG YANA GENIN MAXIME PHILIPPE FREDERIE COX MICHAEL MENCHTCHIKOV BORIS TABERY CYRUS EMIL ZOU YI |
| description | Disclosed is a method for determining a correction relating to a performance metric of a semiconductor manufacturing process. The method comprises obtaining a first set of pre-process metrology data; processing the first set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which a) are correlated to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and aim to determine the correction for said semiconductor manufacturing process by applying a trained model to the processed first set of pre-process metrology data.
公开了一种用于确定与半导体制造过程的性能度量相关的校正的方法，该方法包括：获得第一组预处理量测数据；通过将预处理量测数据分解成一个或多个分量来处理第一组预处理量测数据，该一个或多个分量：a)与性能度量相关；或者b)能够至少部分地通过作为半导体制造过程的一部分的控制过程进行校正；以及将经训练的模型应用于经处理的第一组预处理量测数据以确定对上述半导体制造过程的校正。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113196174A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113196174A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113196174A3</originalsourceid><addsrcrecordid>eNrjZHD3dQ3x8HdRcPMPUnD29wsJ8vfx8fRzV_B19At1c3QOCQ0C8QKC_J1dg4MVHP1cFByDg_2dPR1DXIHMgADHIMeQ0GDXYB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu_sZ2hobGhpZmhu4mhMjBoABhgs8g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR CONTROLLING MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES</title><source>esp@cenet</source><creator>ZHANG YOUPING ; HASTINGS SIMON PHILIP SPENCER ; BRANTJES NICOLAAS PETRUS MARCUS ; LIN CHENXI ; CHENG YANA ; GENIN MAXIME PHILIPPE FREDERIE ; COX MICHAEL ; MENCHTCHIKOV BORIS ; TABERY CYRUS EMIL ; ZOU YI</creator><creatorcontrib>ZHANG YOUPING ; HASTINGS SIMON PHILIP SPENCER ; BRANTJES NICOLAAS PETRUS MARCUS ; LIN CHENXI ; CHENG YANA ; GENIN MAXIME PHILIPPE FREDERIE ; COX MICHAEL ; MENCHTCHIKOV BORIS ; TABERY CYRUS EMIL ; ZOU YI</creatorcontrib><description>Disclosed is a method for determining a correction relating to a performance metric of a semiconductor manufacturing process. The method comprises obtaining a first set of pre-process metrology data; processing the first set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which a) are correlated to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and aim to determine the correction for said semiconductor manufacturing process by applying a trained model to the processed first set of pre-process metrology data.
公开了一种用于确定与半导体制造过程的性能度量相关的校正的方法，该方法包括：获得第一组预处理量测数据；通过将预处理量测数据分解成一个或多个分量来处理第一组预处理量测数据，该一个或多个分量：a)与性能度量相关；或者b)能够至少部分地通过作为半导体制造过程的一部分的控制过程进行校正；以及将经训练的模型应用于经处理的第一组预处理量测数据以确定对上述半导体制造过程的校正。</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210730&DB=EPODOC&CC=CN&NR=113196174A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210730&DB=EPODOC&CC=CN&NR=113196174A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG YOUPING</creatorcontrib><creatorcontrib>HASTINGS SIMON PHILIP SPENCER</creatorcontrib><creatorcontrib>BRANTJES NICOLAAS PETRUS MARCUS</creatorcontrib><creatorcontrib>LIN CHENXI</creatorcontrib><creatorcontrib>CHENG YANA</creatorcontrib><creatorcontrib>GENIN MAXIME PHILIPPE FREDERIE</creatorcontrib><creatorcontrib>COX MICHAEL</creatorcontrib><creatorcontrib>MENCHTCHIKOV BORIS</creatorcontrib><creatorcontrib>TABERY CYRUS EMIL</creatorcontrib><creatorcontrib>ZOU YI</creatorcontrib><title>METHOD FOR CONTROLLING MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES</title><description>Disclosed is a method for determining a correction relating to a performance metric of a semiconductor manufacturing process. The method comprises obtaining a first set of pre-process metrology data; processing the first set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which a) are correlated to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and aim to determine the correction for said semiconductor manufacturing process by applying a trained model to the processed first set of pre-process metrology data.
公开了一种用于确定与半导体制造过程的性能度量相关的校正的方法，该方法包括：获得第一组预处理量测数据；通过将预处理量测数据分解成一个或多个分量来处理第一组预处理量测数据，该一个或多个分量：a)与性能度量相关；或者b)能够至少部分地通过作为半导体制造过程的一部分的控制过程进行校正；以及将经训练的模型应用于经处理的第一组预处理量测数据以确定对上述半导体制造过程的校正。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3dQ3x8HdRcPMPUnD29wsJ8vfx8fRzV_B19At1c3QOCQ0C8QKC_J1dg4MVHP1cFByDg_2dPR1DXIHMgADHIMeQ0GDXYB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu_sZ2hobGhpZmhu4mhMjBoABhgs8g</recordid><startdate>20210730</startdate><enddate>20210730</enddate><creator>ZHANG YOUPING</creator><creator>HASTINGS SIMON PHILIP SPENCER</creator><creator>BRANTJES NICOLAAS PETRUS MARCUS</creator><creator>LIN CHENXI</creator><creator>CHENG YANA</creator><creator>GENIN MAXIME PHILIPPE FREDERIE</creator><creator>COX MICHAEL</creator><creator>MENCHTCHIKOV BORIS</creator><creator>TABERY CYRUS EMIL</creator><creator>ZOU YI</creator><scope>EVB</scope></search><sort><creationdate>20210730</creationdate><title>METHOD FOR CONTROLLING MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES</title><author>ZHANG YOUPING ; HASTINGS SIMON PHILIP SPENCER ; BRANTJES NICOLAAS PETRUS MARCUS ; LIN CHENXI ; CHENG YANA ; GENIN MAXIME PHILIPPE FREDERIE ; COX MICHAEL ; MENCHTCHIKOV BORIS ; TABERY CYRUS EMIL ; ZOU YI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113196174A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG YOUPING</creatorcontrib><creatorcontrib>HASTINGS SIMON PHILIP SPENCER</creatorcontrib><creatorcontrib>BRANTJES NICOLAAS PETRUS MARCUS</creatorcontrib><creatorcontrib>LIN CHENXI</creatorcontrib><creatorcontrib>CHENG YANA</creatorcontrib><creatorcontrib>GENIN MAXIME PHILIPPE FREDERIE</creatorcontrib><creatorcontrib>COX MICHAEL</creatorcontrib><creatorcontrib>MENCHTCHIKOV BORIS</creatorcontrib><creatorcontrib>TABERY CYRUS EMIL</creatorcontrib><creatorcontrib>ZOU YI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG YOUPING</au><au>HASTINGS SIMON PHILIP SPENCER</au><au>BRANTJES NICOLAAS PETRUS MARCUS</au><au>LIN CHENXI</au><au>CHENG YANA</au><au>GENIN MAXIME PHILIPPE FREDERIE</au><au>COX MICHAEL</au><au>MENCHTCHIKOV BORIS</au><au>TABERY CYRUS EMIL</au><au>ZOU YI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR CONTROLLING MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES</title><date>2021-07-30</date><risdate>2021</risdate><abstract>Disclosed is a method for determining a correction relating to a performance metric of a semiconductor manufacturing process. The method comprises obtaining a first set of pre-process metrology data; processing the first set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which a) are correlated to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and aim to determine the correction for said semiconductor manufacturing process by applying a trained model to the processed first set of pre-process metrology data.
公开了一种用于确定与半导体制造过程的性能度量相关的校正的方法，该方法包括：获得第一组预处理量测数据；通过将预处理量测数据分解成一个或多个分量来处理第一组预处理量测数据，该一个或多个分量：a)与性能度量相关；或者b)能够至少部分地通过作为半导体制造过程的一部分的控制过程进行校正；以及将经训练的模型应用于经处理的第一组预处理量测数据以确定对上述半导体制造过程的校正。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN113196174A |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | METHOD FOR CONTROLLING MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T04%3A41%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHANG%20YOUPING&rft.date=2021-07-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN113196174A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |