Display assembly and preparation method thereof
The invention relates to the technical field of display, in particular to a display assembly and a preparation method thereof. The display assembly comprises a substrate, at least one light-emitting unit and a bonding layer, the bonding layer is arranged between the substrate and the light-emitting...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | CHEN YONGMING LEI HAO QIU CHANGBO |
description | The invention relates to the technical field of display, in particular to a display assembly and a preparation method thereof. The display assembly comprises a substrate, at least one light-emitting unit and a bonding layer, the bonding layer is arranged between the substrate and the light-emitting unit, fixes the light-emitting unit and is electrically connected with the substrate, and the substrate is a titanium-aluminum alloy substrate; the bonding layer comprises resin and silver particles, and a reflecting layer is arranged on the face, provided with the light-emitting unit, of the substrate and is a silver layer. On the basis that the titanium-aluminum alloy serves as the substrate, a binder of resin and silver particles serves as a conductive and curing agent, so that the defect that the conductivity is poor due to the fact that the cross-linking bonding degree of the titanium-aluminum alloy and the binder is low can be well overcome, and the conductive performance and the connection stability of the s |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113178436A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113178436A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113178436A3</originalsourceid><addsrcrecordid>eNrjZNB3ySwuyEmsVEgsLk7NTcoBMvJSFAqKUgsSixJLMvPzFHJTSzLyUxRKMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGxobmFibGZozExagBLvys2</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Display assembly and preparation method thereof</title><source>esp@cenet</source><creator>CHEN YONGMING ; LEI HAO ; QIU CHANGBO</creator><creatorcontrib>CHEN YONGMING ; LEI HAO ; QIU CHANGBO</creatorcontrib><description>The invention relates to the technical field of display, in particular to a display assembly and a preparation method thereof. The display assembly comprises a substrate, at least one light-emitting unit and a bonding layer, the bonding layer is arranged between the substrate and the light-emitting unit, fixes the light-emitting unit and is electrically connected with the substrate, and the substrate is a titanium-aluminum alloy substrate; the bonding layer comprises resin and silver particles, and a reflecting layer is arranged on the face, provided with the light-emitting unit, of the substrate and is a silver layer. On the basis that the titanium-aluminum alloy serves as the substrate, a binder of resin and silver particles serves as a conductive and curing agent, so that the defect that the conductivity is poor due to the fact that the cross-linking bonding degree of the titanium-aluminum alloy and the binder is low can be well overcome, and the conductive performance and the connection stability of the s</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210727&DB=EPODOC&CC=CN&NR=113178436A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210727&DB=EPODOC&CC=CN&NR=113178436A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN YONGMING</creatorcontrib><creatorcontrib>LEI HAO</creatorcontrib><creatorcontrib>QIU CHANGBO</creatorcontrib><title>Display assembly and preparation method thereof</title><description>The invention relates to the technical field of display, in particular to a display assembly and a preparation method thereof. The display assembly comprises a substrate, at least one light-emitting unit and a bonding layer, the bonding layer is arranged between the substrate and the light-emitting unit, fixes the light-emitting unit and is electrically connected with the substrate, and the substrate is a titanium-aluminum alloy substrate; the bonding layer comprises resin and silver particles, and a reflecting layer is arranged on the face, provided with the light-emitting unit, of the substrate and is a silver layer. On the basis that the titanium-aluminum alloy serves as the substrate, a binder of resin and silver particles serves as a conductive and curing agent, so that the defect that the conductivity is poor due to the fact that the cross-linking bonding degree of the titanium-aluminum alloy and the binder is low can be well overcome, and the conductive performance and the connection stability of the s</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB3ySwuyEmsVEgsLk7NTcoBMvJSFAqKUgsSixJLMvPzFHJTSzLyUxRKMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGxobmFibGZozExagBLvys2</recordid><startdate>20210727</startdate><enddate>20210727</enddate><creator>CHEN YONGMING</creator><creator>LEI HAO</creator><creator>QIU CHANGBO</creator><scope>EVB</scope></search><sort><creationdate>20210727</creationdate><title>Display assembly and preparation method thereof</title><author>CHEN YONGMING ; LEI HAO ; QIU CHANGBO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113178436A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN YONGMING</creatorcontrib><creatorcontrib>LEI HAO</creatorcontrib><creatorcontrib>QIU CHANGBO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN YONGMING</au><au>LEI HAO</au><au>QIU CHANGBO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Display assembly and preparation method thereof</title><date>2021-07-27</date><risdate>2021</risdate><abstract>The invention relates to the technical field of display, in particular to a display assembly and a preparation method thereof. The display assembly comprises a substrate, at least one light-emitting unit and a bonding layer, the bonding layer is arranged between the substrate and the light-emitting unit, fixes the light-emitting unit and is electrically connected with the substrate, and the substrate is a titanium-aluminum alloy substrate; the bonding layer comprises resin and silver particles, and a reflecting layer is arranged on the face, provided with the light-emitting unit, of the substrate and is a silver layer. On the basis that the titanium-aluminum alloy serves as the substrate, a binder of resin and silver particles serves as a conductive and curing agent, so that the defect that the conductivity is poor due to the fact that the cross-linking bonding degree of the titanium-aluminum alloy and the binder is low can be well overcome, and the conductive performance and the connection stability of the s</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN113178436A |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Display assembly and preparation method thereof |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T08%3A45%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN%20YONGMING&rft.date=2021-07-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN113178436A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |