LASER PROCESSING DEVICE AND METHOD FOR PROCESSING WORKPIECE

This laser processing device is provided with: a placement table for placing a workpiece; a shaping optical system that shapes a laser beam so that an irradiation region of the laser beam has a rectangular shape having short sides and long sides in a mask configured to shield a portion of the laser...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SHINBORI MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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