VACUUM PUMP PROTECTION AGAINST DEPOSITION BYPRODUCT BUILDUP

A processing chamber such as a plasma etch chamber can perform deposition and etch operations, where byproducts of the deposition and etch operations can build up in a vacuum pump system fluidly coupled to the processing chamber. A vacuum pump system may have multiple roughing pumps so that etch gases can be diverted a roughing pump and deposition precursors can be diverted to another roughing pump. A divert line may route unused deposition precursors through a separate roughing pump. Deposition byproducts can be prevented from forming by incorporating one or more gas ejectors or venturi pumps at an outlet of a primary pump in a vacuum pump system. Cleaning operations, such as waferless automated cleaning operations, using certain clean chemistries may remove deposition byproducts before or after etch operations. 一种处理室(例如等离子体蚀刻室)可执行沉积和蚀刻操作，其中沉积和蚀刻操作的副产物可能在与处理室流体耦合的真空泵系统中积聚。真空泵系统可具有多个粗抽泵，使得蚀刻气体可被分流至一粗抽泵而沉积前体可被分流至另一粗抽泵。分流管线可将未使用的沉积前体引导通过分离的粗抽泵。通过在真空泵系统中的初级泵的出口处包含一或更多个气体喷射器或文丘里泵，可避免沉积副产物形成。使用某些清洁化学品的清洁操作(例如无晶片自动