CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE
Provided are: a condensation-curable resin composition and a cured product from which a molded body in which embrittlement and coloring hardly occur even when exposed to a high temperature for a long period of time can be obtained; and a molded body and a semiconductor device using the same. The pre...
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| creator | KIYA AYAKA KAWABATA KIICHI IKENO HIRONORI SUWA KAZUYA NISHIZAWA KEISUKE |
| description | Provided are: a condensation-curable resin composition and a cured product from which a molded body in which embrittlement and coloring hardly occur even when exposed to a high temperature for a long period of time can be obtained; and a molded body and a semiconductor device using the same. The present invention relates to a condensation-curable resin composition comprising: (A) an organosilicon compound; and (B) an organometallic compound having 3 or more condensable groups, wherein the (A) organosilicon compound contains a structural unit (i) represented by formula (i) and a structural unit (ii) represented by formula (ii), has SiOH groups at respective both ends of a molecular chain, and has a weight average molecular weight of 10,000-10,000,000. In formula (i), R1s is each independently a hydrocarbon group having 1 to 8 carbon atoms. In formula (ii), R2s are each independently a hydrocarbon group having 1 to 8 carbon atoms.
提供一种可获得即便长期暴露于高温下也难以产生脆化及着色的成形体的缩合硬化型树脂组合物及状硬化物、以及使用有这些的成形体及半导体装置。本发明为一种缩合硬化型树脂组合 |
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提供一种可获得即便长期暴露于高温下也难以产生脆化及着色的成形体的缩合硬化型树脂组合物及状硬化物、以及使用有这些的成形体及半导体装置。本发明为一种缩合硬化型树脂组合</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210723&DB=EPODOC&CC=CN&NR=113166544A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210723&DB=EPODOC&CC=CN&NR=113166544A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIYA AYAKA</creatorcontrib><creatorcontrib>KAWABATA KIICHI</creatorcontrib><creatorcontrib>IKENO HIRONORI</creatorcontrib><creatorcontrib>SUWA KAZUYA</creatorcontrib><creatorcontrib>NISHIZAWA KEISUKE</creatorcontrib><title>CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE</title><description>Provided are: a condensation-curable resin composition and a cured product from which a molded body in which embrittlement and coloring hardly occur even when exposed to a high temperature for a long period of time can be obtained; and a molded body and a semiconductor device using the same. The present invention relates to a condensation-curable resin composition comprising: (A) an organosilicon compound; and (B) an organometallic compound having 3 or more condensable groups, wherein the (A) organosilicon compound contains a structural unit (i) represented by formula (i) and a structural unit (ii) represented by formula (ii), has SiOH groups at respective both ends of a molecular chain, and has a weight average molecular weight of 10,000-10,000,000. In formula (i), R1s is each independently a hydrocarbon group having 1 to 8 carbon atoms. In formula (ii), R2s are each independently a hydrocarbon group having 1 to 8 carbon atoms.
提供一种可获得即便长期暴露于高温下也难以产生脆化及着色的成形体的缩合硬化型树脂组合物及状硬化物、以及使用有这些的成形体及半导体装置。本发明为一种缩合硬化型树脂组合</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzEELgkAQBWAvHaL6D9NdD4vmfZ2ZaMHdkV0VgkAktlOUYP-fFPoBnR6P7_G2yQ3FEbugWyMuw87rqmbwHIwDFNtIMKuksBATNF6owzYFKzUtvRK6pqAdQWBr1q9FxQNxb5D3yeYxPud4-OUuOZ65xUsWp_cQ52m8x1f8DOiUylVZnopC5_9svrpNMkM</recordid><startdate>20210723</startdate><enddate>20210723</enddate><creator>KIYA AYAKA</creator><creator>KAWABATA KIICHI</creator><creator>IKENO HIRONORI</creator><creator>SUWA KAZUYA</creator><creator>NISHIZAWA KEISUKE</creator><scope>EVB</scope></search><sort><creationdate>20210723</creationdate><title>CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE</title><author>KIYA AYAKA ; KAWABATA KIICHI ; IKENO HIRONORI ; SUWA KAZUYA ; NISHIZAWA KEISUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113166544A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIYA AYAKA</creatorcontrib><creatorcontrib>KAWABATA KIICHI</creatorcontrib><creatorcontrib>IKENO HIRONORI</creatorcontrib><creatorcontrib>SUWA KAZUYA</creatorcontrib><creatorcontrib>NISHIZAWA KEISUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIYA AYAKA</au><au>KAWABATA KIICHI</au><au>IKENO HIRONORI</au><au>SUWA KAZUYA</au><au>NISHIZAWA KEISUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE</title><date>2021-07-23</date><risdate>2021</risdate><abstract>Provided are: a condensation-curable resin composition and a cured product from which a molded body in which embrittlement and coloring hardly occur even when exposed to a high temperature for a long period of time can be obtained; and a molded body and a semiconductor device using the same. The present invention relates to a condensation-curable resin composition comprising: (A) an organosilicon compound; and (B) an organometallic compound having 3 or more condensable groups, wherein the (A) organosilicon compound contains a structural unit (i) represented by formula (i) and a structural unit (ii) represented by formula (ii), has SiOH groups at respective both ends of a molecular chain, and has a weight average molecular weight of 10,000-10,000,000. In formula (i), R1s is each independently a hydrocarbon group having 1 to 8 carbon atoms. In formula (ii), R2s are each independently a hydrocarbon group having 1 to 8 carbon atoms.
提供一种可获得即便长期暴露于高温下也难以产生脆化及着色的成形体的缩合硬化型树脂组合物及状硬化物、以及使用有这些的成形体及半导体装置。本发明为一种缩合硬化型树脂组合</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE |
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