Automatic heat dissipation communication device based on 5G

Automatic heat dissipation communication device based on 5G

The invention discloses a 5G-based automatic heat dissipation communication device. The device comprises a main body assembly, a main body heat dissipation assembly and an auxiliary heat dissipation assembly, wherein the main body assembly comprises a shell, a cover plate, a PLC plate, a temperature...

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Hauptverfasser: HAN RUIXUE, ZHAO QIUHAN, WANG HUI
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Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HAN RUIXUE
ZHAO QIUHAN
WANG HUI
description The invention discloses a 5G-based automatic heat dissipation communication device. The device comprises a main body assembly, a main body heat dissipation assembly and an auxiliary heat dissipation assembly, wherein the main body assembly comprises a shell, a cover plate, a PLC plate, a temperature sensor, a signal transmitter, a bottom plate and a mounting hole; the main body heat dissipation assembly comprises a fan, a water tank, a micro water pump, a pipe body, a coil pipe and a water inlet pipe; the fan is installed on an upper surface of the cover plate in an embedded mode, the water tank is welded to a lower surface of the cover plate, an upper surface of the water tank communicates with a water inlet pipe, and a micro water pump is installed on one side of the water tank; a water source is injected into the water tank through the water inlet pipe, the water source in the water tank flows in the coil pipe, heat in the shell is absorbed in the flowing process of the water source, at the moment, the wat
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The device comprises a main body assembly, a main body heat dissipation assembly and an auxiliary heat dissipation assembly, wherein the main body assembly comprises a shell, a cover plate, a PLC plate, a temperature sensor, a signal transmitter, a bottom plate and a mounting hole; the main body heat dissipation assembly comprises a fan, a water tank, a micro water pump, a pipe body, a coil pipe and a water inlet pipe; the fan is installed on an upper surface of the cover plate in an embedded mode, the water tank is welded to a lower surface of the cover plate, an upper surface of the water tank communicates with a water inlet pipe, and a micro water pump is installed on one side of the water tank; a water source is injected into the water tank through the water inlet pipe, the water source in the water tank flows in the coil pipe, heat in the shell is absorbed in the flowing process of the water source, at the moment, the wat</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210723&amp;DB=EPODOC&amp;CC=CN&amp;NR=113163696A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210723&amp;DB=EPODOC&amp;CC=CN&amp;NR=113163696A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAN RUIXUE</creatorcontrib><creatorcontrib>ZHAO QIUHAN</creatorcontrib><creatorcontrib>WANG HUI</creatorcontrib><title>Automatic heat dissipation communication device based on 5G</title><description>The invention discloses a 5G-based automatic heat dissipation communication device. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Automatic heat dissipation communication device based on 5G
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