Photoresist coating device and photoresist coating method
A photoresist coating device comprises a chuck, a photoresist nozzle, a cleaning agent nozzle, an edge exposure light source, a developing agent nozzle and an adjusting mechanism, wherein the chuck positions a wafer and drives the wafer to rotate, the photoresist nozzle sprays photoresist to the waf...
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| creator | LIN ZHONGJI ZHANG CHENGGEN TIAN FANHUAN JIN ZAIZHI |
| description | A photoresist coating device comprises a chuck, a photoresist nozzle, a cleaning agent nozzle, an edge exposure light source, a developing agent nozzle and an adjusting mechanism, wherein the chuck positions a wafer and drives the wafer to rotate, the photoresist nozzle sprays photoresist to the wafer positioned on the chuck, the cleaning agent nozzle sprays a cleaning agent to the photoresist on the edge of the wafer, the edge exposure light source exposes photoresist on the edge of the wafer, the developing agent nozzle sprays a developer to the photoresist on the edge of the exposed wafer, and the adjusting mechanism adjusts the cleaning agent nozzle to keep the angle between the sprayed cleaning agent and the surface of the wafer smaller than 30 degrees. The adjusting mechanism adjusts the developing agent nozzle to keep the angle between the sprayed developing agent and the surface of the wafer smaller than 30 degrees. According to the photoresist coating device provided by the invention, the photoresist |
| format | Patent |
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The adjusting mechanism adjusts the developing agent nozzle to keep the angle between the sprayed developing agent and the surface of the wafer smaller than 30 degrees. According to the photoresist coating device provided by the invention, the photoresist</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210720&DB=EPODOC&CC=CN&NR=113138535A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210720&DB=EPODOC&CC=CN&NR=113138535A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN ZHONGJI</creatorcontrib><creatorcontrib>ZHANG CHENGGEN</creatorcontrib><creatorcontrib>TIAN FANHUAN</creatorcontrib><creatorcontrib>JIN ZAIZHI</creatorcontrib><title>Photoresist coating device and photoresist coating method</title><description>A photoresist coating device comprises a chuck, a photoresist nozzle, a cleaning agent nozzle, an edge exposure light source, a developing agent nozzle and an adjusting mechanism, wherein the chuck positions a wafer and drives the wafer to rotate, the photoresist nozzle sprays photoresist to the wafer positioned on the chuck, the cleaning agent nozzle sprays a cleaning agent to the photoresist on the edge of the wafer, the edge exposure light source exposes photoresist on the edge of the wafer, the developing agent nozzle sprays a developer to the photoresist on the edge of the exposed wafer, and the adjusting mechanism adjusts the cleaning agent nozzle to keep the angle between the sprayed cleaning agent and the surface of the wafer smaller than 30 degrees. The adjusting mechanism adjusts the developing agent nozzle to keep the angle between the sprayed developing agent and the surface of the wafer smaller than 30 degrees. According to the photoresist coating device provided by the invention, the photoresist</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAMyMgvyS9KLc4sLlFIzk8sycxLV0hJLctMTlVIzEtRKMAinZtakpGfwsPAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA2NDY0tTI1NHY2JUQMAgvUvMg</recordid><startdate>20210720</startdate><enddate>20210720</enddate><creator>LIN ZHONGJI</creator><creator>ZHANG CHENGGEN</creator><creator>TIAN FANHUAN</creator><creator>JIN ZAIZHI</creator><scope>EVB</scope></search><sort><creationdate>20210720</creationdate><title>Photoresist coating device and photoresist coating method</title><author>LIN ZHONGJI ; ZHANG CHENGGEN ; TIAN FANHUAN ; JIN ZAIZHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113138535A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN ZHONGJI</creatorcontrib><creatorcontrib>ZHANG CHENGGEN</creatorcontrib><creatorcontrib>TIAN FANHUAN</creatorcontrib><creatorcontrib>JIN ZAIZHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN ZHONGJI</au><au>ZHANG CHENGGEN</au><au>TIAN FANHUAN</au><au>JIN ZAIZHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photoresist coating device and photoresist coating method</title><date>2021-07-20</date><risdate>2021</risdate><abstract>A photoresist coating device comprises a chuck, a photoresist nozzle, a cleaning agent nozzle, an edge exposure light source, a developing agent nozzle and an adjusting mechanism, wherein the chuck positions a wafer and drives the wafer to rotate, the photoresist nozzle sprays photoresist to the wafer positioned on the chuck, the cleaning agent nozzle sprays a cleaning agent to the photoresist on the edge of the wafer, the edge exposure light source exposes photoresist on the edge of the wafer, the developing agent nozzle sprays a developer to the photoresist on the edge of the exposed wafer, and the adjusting mechanism adjusts the cleaning agent nozzle to keep the angle between the sprayed cleaning agent and the surface of the wafer smaller than 30 degrees. The adjusting mechanism adjusts the developing agent nozzle to keep the angle between the sprayed developing agent and the surface of the wafer smaller than 30 degrees. According to the photoresist coating device provided by the invention, the photoresist</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | Photoresist coating device and photoresist coating method |
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