Modularized integrated processor assembly and processing technology thereof

Modularized integrated processor assembly and processing technology thereof

The invention discloses a modularized integrated processor assembly and a processing technology thereof, and relates to the technical field of computer modules. The modularized integrated processor assembly comprises a cooling assembly arranged on a chip, and the cooling assembly comprises a main he...

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1. Verfasser: CHEN YOUFEN
Format: Patent
Sprache:chi ; eng
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CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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creator CHEN YOUFEN
description The invention discloses a modularized integrated processor assembly and a processing technology thereof, and relates to the technical field of computer modules. The modularized integrated processor assembly comprises a cooling assembly arranged on a chip, and the cooling assembly comprises a main heat conduction sheet used for being attached to the chip for heat dissipation and a heat dissipation piece arranged on the side, opposite to the chip, of the main heat conduction sheet, an auxiliary heat conduction sheet faceing one side of the chip. A heat dissipation cavity is formed in the main heat conduction piece, two liquid inlet pipes are connected to the main heat conduction piece, and the liquid inlet pipes are used for circularly supplying cooling liquid to the heat dissipation cavity; the auxiliary heat conduction sheet is embedded in the groove of the main heat conduction sheet and is flush with the surface, attached to the chip, of the main heat conduction sheet, and the main heat conduction sheet and
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language chi ; eng
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subjects CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
title Modularized integrated processor assembly and processing technology thereof
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