Blind hole type multi-layer mixed-pressing aluminum substrate preparation process and multi-layer mixed-pressing aluminum substrate

The invention discloses a blind hole type multi-layer mixed pressing aluminum substrate preparation technology, which comprises the steps that a base layer, a dielectric layer and a core layer are manufactured, and groove milling treatment is conducted on the grooving areas of the base layer, the di...

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Bibliographische Detailangaben

1. Verfasser:	WU CHANGGEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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