Blind hole type multi-layer mixed-pressing aluminum substrate preparation process and multi-layer mixed-pressing aluminum substrate
The invention discloses a blind hole type multi-layer mixed pressing aluminum substrate preparation technology, which comprises the steps that a base layer, a dielectric layer and a core layer are manufactured, and groove milling treatment is conducted on the grooving areas of the base layer, the di...
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| creator | WU CHANGGEN |
| description | The invention discloses a blind hole type multi-layer mixed pressing aluminum substrate preparation technology, which comprises the steps that a base layer, a dielectric layer and a core layer are manufactured, and groove milling treatment is conducted on the grooving areas of the base layer, the dielectric layer and the core layer respectively, wherein the size of the groove of the base layer is smaller than that of the groove of the core layer, and the size of the groove of the core layer is smaller than that of the groove of the dielectric layer; the base layer, the dielectric layer and the core layer which are subjected to groove milling treatment are sequentially stacked and then pressed to obtain an aluminum substrate; and the redundant part of the groove of the base layer is milled off according to the size of the groove of the core layer on the aluminum substrate, so that the size of the groove of the base layer is the same as that of the groove of the core layer. According to the invention, after lam |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Blind hole type multi-layer mixed-pressing aluminum substrate preparation process and multi-layer mixed-pressing aluminum substrate |
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