COP material flexible circuit board
The invention discloses a COP material flexible circuit board, and relates to the technical field of circuit boards. The problem that a circuit board is prone to deformation and damage is solved. The circuit board specifically comprises a circuit board body arranged on the inner wall of the bottom o...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HU QIAOCHEN JUAN PEIJUN YANG SHUNTAO |
| description | The invention discloses a COP material flexible circuit board, and relates to the technical field of circuit boards. The problem that a circuit board is prone to deformation and damage is solved. The circuit board specifically comprises a circuit board body arranged on the inner wall of the bottom of a shell, and more than four rubber columns are arranged on the inner walls of the periphery of the shell; four clamping columns are arranged on the inner wall of the bottom of the shell; protective blocks are arranged on the outer walls of the two sides of the circuit board body, elastic layers are arranged on the inner walls of one sides of the two protective blocks, the outer walls of the bottoms of the two protective blocks are fixed to the inner wall of the bottom of the shell through four clamping grooves, the four clamping grooves are divided into two groups, and the outer walls of the tops of the two groups of clamping grooves are arranged on the outer walls of the bottoms of the two protective blocks resp |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112996325A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112996325A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112996325A3</originalsourceid><addsrcrecordid>eNrjZFB29g9QyE0sSS3KTMxRSMtJrchMyklVSM4sSi7NLFFIyk8sSuFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGRpaWZsZGpo7GxKgBALICJg0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COP material flexible circuit board</title><source>esp@cenet</source><creator>HU QIAOCHEN ; JUAN PEIJUN ; YANG SHUNTAO</creator><creatorcontrib>HU QIAOCHEN ; JUAN PEIJUN ; YANG SHUNTAO</creatorcontrib><description>The invention discloses a COP material flexible circuit board, and relates to the technical field of circuit boards. The problem that a circuit board is prone to deformation and damage is solved. The circuit board specifically comprises a circuit board body arranged on the inner wall of the bottom of a shell, and more than four rubber columns are arranged on the inner walls of the periphery of the shell; four clamping columns are arranged on the inner wall of the bottom of the shell; protective blocks are arranged on the outer walls of the two sides of the circuit board body, elastic layers are arranged on the inner walls of one sides of the two protective blocks, the outer walls of the bottoms of the two protective blocks are fixed to the inner wall of the bottom of the shell through four clamping grooves, the four clamping grooves are divided into two groups, and the outer walls of the tops of the two groups of clamping grooves are arranged on the outer walls of the bottoms of the two protective blocks resp</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210618&DB=EPODOC&CC=CN&NR=112996325A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210618&DB=EPODOC&CC=CN&NR=112996325A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU QIAOCHEN</creatorcontrib><creatorcontrib>JUAN PEIJUN</creatorcontrib><creatorcontrib>YANG SHUNTAO</creatorcontrib><title>COP material flexible circuit board</title><description>The invention discloses a COP material flexible circuit board, and relates to the technical field of circuit boards. The problem that a circuit board is prone to deformation and damage is solved. The circuit board specifically comprises a circuit board body arranged on the inner wall of the bottom of a shell, and more than four rubber columns are arranged on the inner walls of the periphery of the shell; four clamping columns are arranged on the inner wall of the bottom of the shell; protective blocks are arranged on the outer walls of the two sides of the circuit board body, elastic layers are arranged on the inner walls of one sides of the two protective blocks, the outer walls of the bottoms of the two protective blocks are fixed to the inner wall of the bottom of the shell through four clamping grooves, the four clamping grooves are divided into two groups, and the outer walls of the tops of the two groups of clamping grooves are arranged on the outer walls of the bottoms of the two protective blocks resp</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB29g9QyE0sSS3KTMxRSMtJrchMyklVSM4sSi7NLFFIyk8sSuFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGRpaWZsZGpo7GxKgBALICJg0</recordid><startdate>20210618</startdate><enddate>20210618</enddate><creator>HU QIAOCHEN</creator><creator>JUAN PEIJUN</creator><creator>YANG SHUNTAO</creator><scope>EVB</scope></search><sort><creationdate>20210618</creationdate><title>COP material flexible circuit board</title><author>HU QIAOCHEN ; JUAN PEIJUN ; YANG SHUNTAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112996325A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HU QIAOCHEN</creatorcontrib><creatorcontrib>JUAN PEIJUN</creatorcontrib><creatorcontrib>YANG SHUNTAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU QIAOCHEN</au><au>JUAN PEIJUN</au><au>YANG SHUNTAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COP material flexible circuit board</title><date>2021-06-18</date><risdate>2021</risdate><abstract>The invention discloses a COP material flexible circuit board, and relates to the technical field of circuit boards. The problem that a circuit board is prone to deformation and damage is solved. The circuit board specifically comprises a circuit board body arranged on the inner wall of the bottom of a shell, and more than four rubber columns are arranged on the inner walls of the periphery of the shell; four clamping columns are arranged on the inner wall of the bottom of the shell; protective blocks are arranged on the outer walls of the two sides of the circuit board body, elastic layers are arranged on the inner walls of one sides of the two protective blocks, the outer walls of the bottoms of the two protective blocks are fixed to the inner wall of the bottom of the shell through four clamping grooves, the four clamping grooves are divided into two groups, and the outer walls of the tops of the two groups of clamping grooves are arranged on the outer walls of the bottoms of the two protective blocks resp</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN112996325A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | COP material flexible circuit board |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T12%3A54%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HU%20QIAOCHEN&rft.date=2021-06-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN112996325A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |