Packaging device and manufacturing method thereof

The invention provides a packaging device and a manufacturing method thereof, and belongs to the field of semiconductor devices. The packaging device comprises a structure packaging body, a first support plate, a second support plate, an elastic sheet and a chip. The bottom face of the first support...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI CHENG, ZHAN HONGGUI, GAO WENJIAN, YANG NING, YUAN YIKAI, XU HENGJI, CHENG NIANBIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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