Packaging device and manufacturing method thereof

Packaging device and manufacturing method thereof

The invention provides a packaging device and a manufacturing method thereof, and belongs to the field of semiconductor devices. The packaging device comprises a structure packaging body, a first support plate, a second support plate, an elastic sheet and a chip. The bottom face of the first support...

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Hauptverfasser: LI CHENG, ZHAN HONGGUI, GAO WENJIAN, YANG NING, YUAN YIKAI, XU HENGJI, CHENG NIANBIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LI CHENG
ZHAN HONGGUI
GAO WENJIAN
YANG NING
YUAN YIKAI
XU HENGJI
CHENG NIANBIN
description The invention provides a packaging device and a manufacturing method thereof, and belongs to the field of semiconductor devices. The packaging device comprises a structure packaging body, a first support plate, a second support plate, an elastic sheet and a chip. The bottom face of the first support plate and the bottom face of the second support plate are located on the same plane. The chip is located on the top surface of the first support plate, and the bottom surface of the chip is in contact with the top surface of the first support plate; the head part of the elastic sheet is connected with the second support plate, and the tail part of the elastic sheet is in contact with the top surface of the chip; the first support plate, the second support plate, the elastic sheet and the chip are packaged based on the structure packaging body, and the bottom surface of the first support plate and the bottom surface of the second support plate extend out of the structure packaging body. The design structure of the
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Packaging device and manufacturing method thereof
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