Liquid cooling plate and power module
The invention discloses a liquid cooling plate and a power module, the liquid cooling plate comprises a heat dissipation module, the heat dissipation module comprises heat conduction fins, a heat conduction flow channel is formed between every two adjacent heat conduction fins, and the area of a hea...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a liquid cooling plate and a power module, the liquid cooling plate comprises a heat dissipation module, the heat dissipation module comprises heat conduction fins, a heat conduction flow channel is formed between every two adjacent heat conduction fins, and the area of a heat conduction surface, directly facing a heating device, of each heat conduction flow channel is gradually increased in the flowing direction of cooling liquid. In the liquid cooling plate provided by the invention, as the area of the heat conduction surface, directly facing the heating device, of the heat conduction flow channel is gradually increased along the flowing direction of the cooling liquid, although the temperature of the cooling liquid in the heat conduction flow channel is gradually increased along the flowing direction, the heat conduction surface of the heat conduction flow channel is increased, namely, the heat exchange area is increased; and therefore, the heat dissipation uniformity of the liquid |
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