Cleaning method of integrated circuit board

The invention discloses a cleaning method of an integrated circuit board. The cleaning method comprises the following steps: (1) blowing away dust adhered to the surface of an integrated circuit board by adopting compressed air; (2) soaking the integrated circuit board in a first cleaning solution,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	HE JIFU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	The invention discloses a cleaning method of an integrated circuit board. The cleaning method comprises the following steps: (1) blowing away dust adhered to the surface of an integrated circuit board by adopting compressed air; (2) soaking the integrated circuit board in a first cleaning solution, and carrying out ultrasonic cleaning for 8-10 min, wherein the first cleaning solution is a mixed solution of chloroform and ethyl alcohol; (3) rinsing the integrated circuit board with water; (4) blowing off water drops on the surface of the integrated circuit board by using compressed air; (5) carrying out spray cleaning on the integrated circuit board by using a second cleaning solution, wherein the second cleaning solution is a mixed solution of sulfuric acid, hydrogen peroxide and water; and (6) rinsing the integrated circuit board with water, and drying to obtain the cleaned integrated circuit board. According to the method, organic residual substances on the surface are cleaned by adopting the first cleaning