Chip packaging module

The invention relates to a chip packaging module. The chip package module includes a package substrate, a chip, and a conductive connection assembly. The chip is disposed on the package substrate. The chip has a first surface and a second surface opposite to the first surface. The first surface is d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHONG SHENGFENG, ZHU ZHENGLUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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