Power resistor and preparation method thereof

Power resistor and preparation method thereof

The invention relates to a power resistor and a preparation method thereof. The power resistor comprises a resistor body, which comprises a ceramic substrate, a full-coverage silver-palladium electrode layer arranged on the back face of the ceramic substrate in a full-coverage mode and a heat dissip...

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Hauptverfasser: HUANG WEIXUN, YU ZHENNING, HAN WANGCHENG, LI MIAO, ZHU SHA
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
RESISTORS
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creator HUANG WEIXUN
YU ZHENNING
HAN WANGCHENG
LI MIAO
ZHU SHA
description The invention relates to a power resistor and a preparation method thereof. The power resistor comprises a resistor body, which comprises a ceramic substrate, a full-coverage silver-palladium electrode layer arranged on the back face of the ceramic substrate in a full-coverage mode and a heat dissipation plate arranged on the full-coverage silver-palladium electrode layer, wherein a nickel-plated layer and a tin-plated layer are arranged on the full-coverage silver-palladium electrode layer. During preparation, the back surface of a ceramic substrate in a resistor body is completely covered with a full-coverage silver-palladium electrode layer, a heat dissipation plate is welded on the full-coverage silver-palladium electrode layer, and a nickel layer and a tin layer are plated on the full-coverage silver-palladium electrode layer, wherein the heat dissipation plate and the full-coverage silver-palladium electrode layer are welded in a hot plate welding mode, and the temperature of a welding hot plate is 230
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112712950A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112712950A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112712950A3</originalsourceid><addsrcrecordid>eNrjZNANyC9PLVIoSi3OLC7JL1JIzEtRKChKLUgsSizJzM9TyE0tychPUSjJSC1KzU_jYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhkbmhkaWpgaOxsSoAQDs2yp6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power resistor and preparation method thereof</title><source>esp@cenet</source><creator>HUANG WEIXUN ; YU ZHENNING ; HAN WANGCHENG ; LI MIAO ; ZHU SHA</creator><creatorcontrib>HUANG WEIXUN ; YU ZHENNING ; HAN WANGCHENG ; LI MIAO ; ZHU SHA</creatorcontrib><description>The invention relates to a power resistor and a preparation method thereof. The power resistor comprises a resistor body, which comprises a ceramic substrate, a full-coverage silver-palladium electrode layer arranged on the back face of the ceramic substrate in a full-coverage mode and a heat dissipation plate arranged on the full-coverage silver-palladium electrode layer, wherein a nickel-plated layer and a tin-plated layer are arranged on the full-coverage silver-palladium electrode layer. During preparation, the back surface of a ceramic substrate in a resistor body is completely covered with a full-coverage silver-palladium electrode layer, a heat dissipation plate is welded on the full-coverage silver-palladium electrode layer, and a nickel layer and a tin layer are plated on the full-coverage silver-palladium electrode layer, wherein the heat dissipation plate and the full-coverage silver-palladium electrode layer are welded in a hot plate welding mode, and the temperature of a welding hot plate is 230</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; RESISTORS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210427&amp;DB=EPODOC&amp;CC=CN&amp;NR=112712950A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210427&amp;DB=EPODOC&amp;CC=CN&amp;NR=112712950A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG WEIXUN</creatorcontrib><creatorcontrib>YU ZHENNING</creatorcontrib><creatorcontrib>HAN WANGCHENG</creatorcontrib><creatorcontrib>LI MIAO</creatorcontrib><creatorcontrib>ZHU SHA</creatorcontrib><title>Power resistor and preparation method thereof</title><description>The invention relates to a power resistor and a preparation method thereof. The power resistor comprises a resistor body, which comprises a ceramic substrate, a full-coverage silver-palladium electrode layer arranged on the back face of the ceramic substrate in a full-coverage mode and a heat dissipation plate arranged on the full-coverage silver-palladium electrode layer, wherein a nickel-plated layer and a tin-plated layer are arranged on the full-coverage silver-palladium electrode layer. During preparation, the back surface of a ceramic substrate in a resistor body is completely covered with a full-coverage silver-palladium electrode layer, a heat dissipation plate is welded on the full-coverage silver-palladium electrode layer, and a nickel layer and a tin layer are plated on the full-coverage silver-palladium electrode layer, wherein the heat dissipation plate and the full-coverage silver-palladium electrode layer are welded in a hot plate welding mode, and the temperature of a welding hot plate is 230</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>RESISTORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANyC9PLVIoSi3OLC7JL1JIzEtRKChKLUgsSizJzM9TyE0tychPUSjJSC1KzU_jYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhkbmhkaWpgaOxsSoAQDs2yp6</recordid><startdate>20210427</startdate><enddate>20210427</enddate><creator>HUANG WEIXUN</creator><creator>YU ZHENNING</creator><creator>HAN WANGCHENG</creator><creator>LI MIAO</creator><creator>ZHU SHA</creator><scope>EVB</scope></search><sort><creationdate>20210427</creationdate><title>Power resistor and preparation method thereof</title><author>HUANG WEIXUN ; YU ZHENNING ; HAN WANGCHENG ; LI MIAO ; ZHU SHA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112712950A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>RESISTORS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG WEIXUN</creatorcontrib><creatorcontrib>YU ZHENNING</creatorcontrib><creatorcontrib>HAN WANGCHENG</creatorcontrib><creatorcontrib>LI MIAO</creatorcontrib><creatorcontrib>ZHU SHA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG WEIXUN</au><au>YU ZHENNING</au><au>HAN WANGCHENG</au><au>LI MIAO</au><au>ZHU SHA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power resistor and preparation method thereof</title><date>2021-04-27</date><risdate>2021</risdate><abstract>The invention relates to a power resistor and a preparation method thereof. The power resistor comprises a resistor body, which comprises a ceramic substrate, a full-coverage silver-palladium electrode layer arranged on the back face of the ceramic substrate in a full-coverage mode and a heat dissipation plate arranged on the full-coverage silver-palladium electrode layer, wherein a nickel-plated layer and a tin-plated layer are arranged on the full-coverage silver-palladium electrode layer. During preparation, the back surface of a ceramic substrate in a resistor body is completely covered with a full-coverage silver-palladium electrode layer, a heat dissipation plate is welded on the full-coverage silver-palladium electrode layer, and a nickel layer and a tin layer are plated on the full-coverage silver-palladium electrode layer, wherein the heat dissipation plate and the full-coverage silver-palladium electrode layer are welded in a hot plate welding mode, and the temperature of a welding hot plate is 230</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRICITY
RESISTORS
title Power resistor and preparation method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T22%3A45%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUANG%20WEIXUN&rft.date=2021-04-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN112712950A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true