IMAGE SENSOR PACKAGE AND MANUFACTURE METHOD THEREOF

An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LUO YUANTING, WU SHENGCAI, LIN YUMIN, HUANG XINYI, NI ZIXUAN, CHEN ZHAORONG, LIN ANGYING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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