CMP machine linkage method and system

The invention discloses a CMP machine table linkage method and system, and relates to the field of semiconductor manufacturing. The CMP machine table linkage system comprises at least two CMP machine tables and at least one buffer chamber; every two adjacent CMP machine tables are connected through...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUO ZHITIAN, XIA JINWEI, XI DA, QU ZHIJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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