CMP machine linkage method and system
The invention discloses a CMP machine table linkage method and system, and relates to the field of semiconductor manufacturing. The CMP machine table linkage system comprises at least two CMP machine tables and at least one buffer chamber; every two adjacent CMP machine tables are connected through...
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| creator | GUO ZHITIAN XIA JINWEI XI DA QU ZHIJUN |
| description | The invention discloses a CMP machine table linkage method and system, and relates to the field of semiconductor manufacturing. The CMP machine table linkage system comprises at least two CMP machine tables and at least one buffer chamber; every two adjacent CMP machine tables are connected through one buffer chamber; each buffer chamber comprises two shielding doors, one shielding door is aligned with the manipulator of the ith CMP machine table, and the other shielding door is aligned with the manipulator of the (i + 1)th CMP machine table; i is an integer greater than or equal to 1; a wafer rack is arranged in the buffer chamber and is used for placing a wafer; the problem that a wafer placed in a faulted CMP machine table is easy to scrap is solved; and the effects that the wafers in the faulted CMP machine are put into a proper environment in time, the adjacent CMP machines are linked to process the taken-out wafers in time, and the wafers are prevented from being scrapped are achieved.
本申请公开了一种CMP机台联动方法 |
| format | Patent |
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本申请公开了一种CMP机台联动方法</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB19g1QyE1MzsjMS1XIyczLTkxPVchNLcnIT1FIzEtRKK4sLknN5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoZG5gaGBsYWjsbEqAEA98Qmgw</recordid><startdate>20210423</startdate><enddate>20210423</enddate><creator>GUO ZHITIAN</creator><creator>XIA JINWEI</creator><creator>XI DA</creator><creator>QU ZHIJUN</creator><scope>EVB</scope></search><sort><creationdate>20210423</creationdate><title>CMP machine linkage method and system</title><author>GUO ZHITIAN ; XIA JINWEI ; XI DA ; QU ZHIJUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112701038A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GUO ZHITIAN</creatorcontrib><creatorcontrib>XIA JINWEI</creatorcontrib><creatorcontrib>XI DA</creatorcontrib><creatorcontrib>QU ZHIJUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUO ZHITIAN</au><au>XIA JINWEI</au><au>XI DA</au><au>QU ZHIJUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CMP machine linkage method and system</title><date>2021-04-23</date><risdate>2021</risdate><abstract>The invention discloses a CMP machine table linkage method and system, and relates to the field of semiconductor manufacturing. The CMP machine table linkage system comprises at least two CMP machine tables and at least one buffer chamber; every two adjacent CMP machine tables are connected through one buffer chamber; each buffer chamber comprises two shielding doors, one shielding door is aligned with the manipulator of the ith CMP machine table, and the other shielding door is aligned with the manipulator of the (i + 1)th CMP machine table; i is an integer greater than or equal to 1; a wafer rack is arranged in the buffer chamber and is used for placing a wafer; the problem that a wafer placed in a faulted CMP machine table is easy to scrap is solved; and the effects that the wafers in the faulted CMP machine are put into a proper environment in time, the adjacent CMP machines are linked to process the taken-out wafers in time, and the wafers are prevented from being scrapped are achieved.
本申请公开了一种CMP机台联动方法</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | CMP machine linkage method and system |
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