Electronic material composition with balanced performance
The invention belongs to the field of electronic material preparation and relates to an electronic material composition with balanced performance. The material is prepared from the following raw materials in parts by weight: 20-30 parts of heat-resistant polyethylene, 3-5 parts of mesoporous silica,...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SHAO TINGTING DONG JUNTANG ZHANG FUCHUN WANG XIAOYANG |
| description | The invention belongs to the field of electronic material preparation and relates to an electronic material composition with balanced performance. The material is prepared from the following raw materials in parts by weight: 20-30 parts of heat-resistant polyethylene, 3-5 parts of mesoporous silica, 1-3 parts of graphene-like molybdenum disulfide, 3.5-6.5 parts of polypyrrole, 3.5-5.5 parts of conductive carbon black, 3-5 parts of N-phenyl maleimide, 3-10 parts of polycarbonate, 10-15 parts of a silane coupling agent KH-550, 5-10 parts of heat-conducting filler and 0.1-1 part of an antioxidant. The obtained electronic material has good thermal conductivity and heat resistance, a high melting point and good mechanical properties; the melting point of the electronic material is 250-280 DEG C; and the thermal conductivity coefficient of the electronic material reaches about 55 W/m.K.
本发明涉及电子材料制备领域，具体涉及一种性能均衡的电子材料组合物，由以下重量份的原料制备而成:耐热聚乙烯20-30份、介孔二氧化硅3-5份、类石墨烯二硫化钼1-3份、聚吡咯3.5-6.5份、导电炭黑3.5-5.5份、N-苯基马来酰亚胺3-5份、聚碳酸酯3-10 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112679834A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112679834A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112679834A3</originalsourceid><addsrcrecordid>eNrjZLB0zUlNLinKz8tMVshNLEktykzMUUjOzy3IL84syczPUyjPLMlQSErMScxLTk1RKEgtSssvygVxeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGRmbmlhbGJozExagCIWS9V</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic material composition with balanced performance</title><source>esp@cenet</source><creator>SHAO TINGTING ; DONG JUNTANG ; ZHANG FUCHUN ; WANG XIAOYANG</creator><creatorcontrib>SHAO TINGTING ; DONG JUNTANG ; ZHANG FUCHUN ; WANG XIAOYANG</creatorcontrib><description>The invention belongs to the field of electronic material preparation and relates to an electronic material composition with balanced performance. The material is prepared from the following raw materials in parts by weight: 20-30 parts of heat-resistant polyethylene, 3-5 parts of mesoporous silica, 1-3 parts of graphene-like molybdenum disulfide, 3.5-6.5 parts of polypyrrole, 3.5-5.5 parts of conductive carbon black, 3-5 parts of N-phenyl maleimide, 3-10 parts of polycarbonate, 10-15 parts of a silane coupling agent KH-550, 5-10 parts of heat-conducting filler and 0.1-1 part of an antioxidant. The obtained electronic material has good thermal conductivity and heat resistance, a high melting point and good mechanical properties; the melting point of the electronic material is 250-280 DEG C; and the thermal conductivity coefficient of the electronic material reaches about 55 W/m.K.
本发明涉及电子材料制备领域，具体涉及一种性能均衡的电子材料组合物，由以下重量份的原料制备而成:耐热聚乙烯20-30份、介孔二氧化硅3-5份、类石墨烯二硫化钼1-3份、聚吡咯3.5-6.5份、导电炭黑3.5-5.5份、N-苯基马来酰亚胺3-5份、聚碳酸酯3-10</description><language>chi ; eng</language><subject>ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210420&DB=EPODOC&CC=CN&NR=112679834A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210420&DB=EPODOC&CC=CN&NR=112679834A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAO TINGTING</creatorcontrib><creatorcontrib>DONG JUNTANG</creatorcontrib><creatorcontrib>ZHANG FUCHUN</creatorcontrib><creatorcontrib>WANG XIAOYANG</creatorcontrib><title>Electronic material composition with balanced performance</title><description>The invention belongs to the field of electronic material preparation and relates to an electronic material composition with balanced performance. The material is prepared from the following raw materials in parts by weight: 20-30 parts of heat-resistant polyethylene, 3-5 parts of mesoporous silica, 1-3 parts of graphene-like molybdenum disulfide, 3.5-6.5 parts of polypyrrole, 3.5-5.5 parts of conductive carbon black, 3-5 parts of N-phenyl maleimide, 3-10 parts of polycarbonate, 10-15 parts of a silane coupling agent KH-550, 5-10 parts of heat-conducting filler and 0.1-1 part of an antioxidant. The obtained electronic material has good thermal conductivity and heat resistance, a high melting point and good mechanical properties; the melting point of the electronic material is 250-280 DEG C; and the thermal conductivity coefficient of the electronic material reaches about 55 W/m.K.
本发明涉及电子材料制备领域，具体涉及一种性能均衡的电子材料组合物，由以下重量份的原料制备而成:耐热聚乙烯20-30份、介孔二氧化硅3-5份、类石墨烯二硫化钼1-3份、聚吡咯3.5-6.5份、导电炭黑3.5-5.5份、N-苯基马来酰亚胺3-5份、聚碳酸酯3-10</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0zUlNLinKz8tMVshNLEktykzMUUjOzy3IL84syczPUyjPLMlQSErMScxLTk1RKEgtSssvygVxeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGRmbmlhbGJozExagCIWS9V</recordid><startdate>20210420</startdate><enddate>20210420</enddate><creator>SHAO TINGTING</creator><creator>DONG JUNTANG</creator><creator>ZHANG FUCHUN</creator><creator>WANG XIAOYANG</creator><scope>EVB</scope></search><sort><creationdate>20210420</creationdate><title>Electronic material composition with balanced performance</title><author>SHAO TINGTING ; DONG JUNTANG ; ZHANG FUCHUN ; WANG XIAOYANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112679834A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHAO TINGTING</creatorcontrib><creatorcontrib>DONG JUNTANG</creatorcontrib><creatorcontrib>ZHANG FUCHUN</creatorcontrib><creatorcontrib>WANG XIAOYANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHAO TINGTING</au><au>DONG JUNTANG</au><au>ZHANG FUCHUN</au><au>WANG XIAOYANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic material composition with balanced performance</title><date>2021-04-20</date><risdate>2021</risdate><abstract>The invention belongs to the field of electronic material preparation and relates to an electronic material composition with balanced performance. The material is prepared from the following raw materials in parts by weight: 20-30 parts of heat-resistant polyethylene, 3-5 parts of mesoporous silica, 1-3 parts of graphene-like molybdenum disulfide, 3.5-6.5 parts of polypyrrole, 3.5-5.5 parts of conductive carbon black, 3-5 parts of N-phenyl maleimide, 3-10 parts of polycarbonate, 10-15 parts of a silane coupling agent KH-550, 5-10 parts of heat-conducting filler and 0.1-1 part of an antioxidant. The obtained electronic material has good thermal conductivity and heat resistance, a high melting point and good mechanical properties; the melting point of the electronic material is 250-280 DEG C; and the thermal conductivity coefficient of the electronic material reaches about 55 W/m.K.
本发明涉及电子材料制备领域，具体涉及一种性能均衡的电子材料组合物，由以下重量份的原料制备而成:耐热聚乙烯20-30份、介孔二氧化硅3-5份、类石墨烯二硫化钼1-3份、聚吡咯3.5-6.5份、导电炭黑3.5-5.5份、N-苯基马来酰亚胺3-5份、聚碳酸酯3-10</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN112679834A |
| source | esp@cenet |
| subjects | ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Electronic material composition with balanced performance |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T05%3A29%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHAO%20TINGTING&rft.date=2021-04-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN112679834A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |