Epoxy resin composition for improving semiconductor packaging appearance and preparation method thereof

The invention provides an epoxy resin composition for improving semiconductor packaging appearance, which is characterized by comprising the following components in parts by weight: 3.5-25 parts of epoxy resin A; 3.55-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an in...

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Bibliographische Detailangaben
Hauptverfasser:	LU XUKUI, LI ZHENG, WANG HANJIE, FENG ZHUOXING, WANG SHANXUE, LI HAILIANG, LI GANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE LIME, MAGNESIA METALLURGY REFRACTORIES SLAG TREATMENT OF NATURAL STONE
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