Epoxy resin composition for improving semiconductor packaging appearance and preparation method thereof
The invention provides an epoxy resin composition for improving semiconductor packaging appearance, which is characterized by comprising the following components in parts by weight: 3.5-25 parts of epoxy resin A; 3.55-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an in...
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| creator | LU XUKUI LI ZHENG WANG HANJIE FENG ZHUOXING WANG SHANXUE LI HAILIANG LI GANG |
| description | The invention provides an epoxy resin composition for improving semiconductor packaging appearance, which is characterized by comprising the following components in parts by weight: 3.5-25 parts of epoxy resin A; 3.55-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler D; 0.01-10 part of a release agent E; 0.01-10 part of a coupling agent F; 0.01-10 part of a flash improving additive G; and 0.1-0.5 part of carbon black. The epoxy resin composition has the following technical effects: by adding the flash improving additive subjected to surface treatment, the overflow length of the epoxy resin composition in different gaps is obviously shorter than that of the common epoxy resin composition after the epoxy resin composition is molded in a mold with a specific gap size; therefore, flash on an integrated circuit and a semiconductor device package is obviously improved.
本发明提供了一种改善半导体封装外观的环氧树脂组合物，其特征在于，按照重量份包括如下组分：环氧树脂A，3.5-25份；固化剂B，3.55-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂 |
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本发明提供了一种改善半导体封装外观的环氧树脂组合物，其特征在于，按照重量份包括如下组分：环氧树脂A，3.5-25份；固化剂B，3.55-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂</description><language>chi ; eng</language><subject>ARTIFICIAL STONE ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; LIME, MAGNESIA ; METALLURGY ; REFRACTORIES ; SLAG ; TREATMENT OF NATURAL STONE</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210420&DB=EPODOC&CC=CN&NR=112679141A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210420&DB=EPODOC&CC=CN&NR=112679141A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU XUKUI</creatorcontrib><creatorcontrib>LI ZHENG</creatorcontrib><creatorcontrib>WANG HANJIE</creatorcontrib><creatorcontrib>FENG ZHUOXING</creatorcontrib><creatorcontrib>WANG SHANXUE</creatorcontrib><creatorcontrib>LI HAILIANG</creatorcontrib><creatorcontrib>LI GANG</creatorcontrib><title>Epoxy resin composition for improving semiconductor packaging appearance and preparation method thereof</title><description>The invention provides an epoxy resin composition for improving semiconductor packaging appearance, which is characterized by comprising the following components in parts by weight: 3.5-25 parts of epoxy resin A; 3.55-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler D; 0.01-10 part of a release agent E; 0.01-10 part of a coupling agent F; 0.01-10 part of a flash improving additive G; and 0.1-0.5 part of carbon black. The epoxy resin composition has the following technical effects: by adding the flash improving additive subjected to surface treatment, the overflow length of the epoxy resin composition in different gaps is obviously shorter than that of the common epoxy resin composition after the epoxy resin composition is molded in a mold with a specific gap size; therefore, flash on an integrated circuit and a semiconductor device package is obviously improved.
本发明提供了一种改善半导体封装外观的环氧树脂组合物，其特征在于，按照重量份包括如下组分：环氧树脂A，3.5-25份；固化剂B，3.55-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂</description><subject>ARTIFICIAL STONE</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>LIME, MAGNESIA</subject><subject>METALLURGY</subject><subject>REFRACTORIES</subject><subject>SLAG</subject><subject>TREATMENT OF NATURAL STONE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKAjEQRbexEPUO4wEsoqJYyrJiZWW_DMlkN6yZGZIoentX8QBWn_94vGnVNSrPFyTKgcFKVMmhBGHwkiBETfII3EGmGKywu9syckU7YPfhqEqYkC0BsgNNpOP9BiKVXhyUnhKJn1cTj7dMi9_OquWpudbnFam0lMciMZW2vhiz3u0PZmuOm3-cN3AJQTQ</recordid><startdate>20210420</startdate><enddate>20210420</enddate><creator>LU XUKUI</creator><creator>LI ZHENG</creator><creator>WANG HANJIE</creator><creator>FENG ZHUOXING</creator><creator>WANG SHANXUE</creator><creator>LI HAILIANG</creator><creator>LI GANG</creator><scope>EVB</scope></search><sort><creationdate>20210420</creationdate><title>Epoxy resin composition for improving semiconductor packaging appearance and preparation method thereof</title><author>LU XUKUI ; LI ZHENG ; WANG HANJIE ; FENG ZHUOXING ; WANG SHANXUE ; LI HAILIANG ; LI GANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112679141A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>ARTIFICIAL STONE</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>LIME, MAGNESIA</topic><topic>METALLURGY</topic><topic>REFRACTORIES</topic><topic>SLAG</topic><topic>TREATMENT OF NATURAL STONE</topic><toplevel>online_resources</toplevel><creatorcontrib>LU XUKUI</creatorcontrib><creatorcontrib>LI ZHENG</creatorcontrib><creatorcontrib>WANG HANJIE</creatorcontrib><creatorcontrib>FENG ZHUOXING</creatorcontrib><creatorcontrib>WANG SHANXUE</creatorcontrib><creatorcontrib>LI HAILIANG</creatorcontrib><creatorcontrib>LI GANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU XUKUI</au><au>LI ZHENG</au><au>WANG HANJIE</au><au>FENG ZHUOXING</au><au>WANG SHANXUE</au><au>LI HAILIANG</au><au>LI GANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Epoxy resin composition for improving semiconductor packaging appearance and preparation method thereof</title><date>2021-04-20</date><risdate>2021</risdate><abstract>The invention provides an epoxy resin composition for improving semiconductor packaging appearance, which is characterized by comprising the following components in parts by weight: 3.5-25 parts of epoxy resin A; 3.55-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler D; 0.01-10 part of a release agent E; 0.01-10 part of a coupling agent F; 0.01-10 part of a flash improving additive G; and 0.1-0.5 part of carbon black. The epoxy resin composition has the following technical effects: by adding the flash improving additive subjected to surface treatment, the overflow length of the epoxy resin composition in different gaps is obviously shorter than that of the common epoxy resin composition after the epoxy resin composition is molded in a mold with a specific gap size; therefore, flash on an integrated circuit and a semiconductor device package is obviously improved.
本发明提供了一种改善半导体封装外观的环氧树脂组合物，其特征在于，按照重量份包括如下组分：环氧树脂A，3.5-25份；固化剂B，3.55-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE LIME, MAGNESIA METALLURGY REFRACTORIES SLAG TREATMENT OF NATURAL STONE |
| title | Epoxy resin composition for improving semiconductor packaging appearance and preparation method thereof |
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