Immiscible metal molybdenum and copper diffusion bonding method adopting consumable intermediate layer

The invention discloses an immiscible metal molybdenum and copper diffusion bonding method adopting a consumable intermediate layer, which comprises the following steps: S1, pretreatment of molybdenum and copper base materials: carrying out mechanical or chemical treatment on to-be-welded surfaces o...

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Bibliographische Detailangaben
Hauptverfasser: LUAN BOYU, LUO JIANYI, WANG HONG, DENG YONGQIANG, GAN SHUDE, GAN LINQIAO, GAO HUANFANG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses an immiscible metal molybdenum and copper diffusion bonding method adopting a consumable intermediate layer, which comprises the following steps: S1, pretreatment of molybdenum and copper base materials: carrying out mechanical or chemical treatment on to-be-welded surfaces of the molybdenum and copper base materials to remove surface oil stains and oxide layers of the to-be-welded surfaces of the base materials so as to meet the requirements of a bonding process; S2, preparing a titanium intermediate layer between the to-be-welded surfaces of the molybdenum and copper base materials; and S3, performing diffusion bonding on the titanium middle layer and the base materials on the two sides, specifically, the assembled molybdenum-titanium middle layer-copper combined component is put into a vacuum furnace, certain pressure is applied to molybdenum or copper according to the technological requirements, heat preservation is conducted for a certain time at the temperature required by the te