Method for synchronously metallizing metal layer and non-metal layer in PCB aluminum substrate hole
The invention provides a method for synchronously metallizing a metal layer and a non-metal layer in a PCB aluminum substrate hole. The method sequentially comprises the following steps of oil removaltreatment, etching, silanization, baking curing, activation and nickel plating. A silane solution us...
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| creator | XIA GUOWEI SHI SHIKUN CHEN TAO ZHAO QIXIANG PAN ZHANCHANG ZHANG YAFENG CUI ZIYA HU GUANGHUI WANG HUI WANG BIN |
| description | The invention provides a method for synchronously metallizing a metal layer and a non-metal layer in a PCB aluminum substrate hole. The method sequentially comprises the following steps of oil removaltreatment, etching, silanization, baking curing, activation and nickel plating. A silane solution used in the silanization treatment comprises a silane coupling agent, a stabilizer and an accelerantin a mass ratio of (1-5): (0.1-10): (0.1-1). According to the method, synchronous metallization of the metal layer and the non-metal layer in the hole can be realized, the skip plating problem in thehole can be solved, and the nickel plating layer with a compact and uniform structure is obtained. According to the method, colloid palladium activation and degelatinization procedures are not needed,the production process is simplified, corrosion to the aluminum substrate is small, and the hole metallized coating obtained through the method has the advantages of being good in flatness, good in binding force and the like an |
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The method sequentially comprises the following steps of oil removaltreatment, etching, silanization, baking curing, activation and nickel plating. A silane solution used in the silanization treatment comprises a silane coupling agent, a stabilizer and an accelerantin a mass ratio of (1-5): (0.1-10): (0.1-1). According to the method, synchronous metallization of the metal layer and the non-metal layer in the hole can be realized, the skip plating problem in thehole can be solved, and the nickel plating layer with a compact and uniform structure is obtained. 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| title | Method for synchronously metallizing metal layer and non-metal layer in PCB aluminum substrate hole |
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