MOUNTING SUBSTRATE MOUNTED WITH IMAGE SENSOR, SENSOR ASSEMBLY, AND METHOD OF MANUFACTURING THE SAME

A mounting substrate mounted with an image sensor, a sensor assembly, and a method of manufacturing the same are provided. The sensor assembly is constructed by molding a frame onto a mounting substrate using insert molding, preventing adhesion to components and terminals and reducing damage to the...

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description A mounting substrate mounted with an image sensor, a sensor assembly, and a method of manufacturing the same are provided. The sensor assembly is constructed by molding a frame onto a mounting substrate using insert molding, preventing adhesion to components and terminals and reducing damage to the mounting substrate. The sensor assembly includes an image sensor, a mounting substrate on which theimage sensor is mounted, a frame provided on the mounting substrate so as to surround the image sensor, and a cover mounted on the frame so as to cover the image sensor. The mounting substrate includes a terminal electrically connected to the image sensor and a groove provided at a predetermined depth between a region where the frame is provided and the terminal. 安装有图像传感器的安装基板、传感器组件及其制造方法。传感器组件通过利用嵌入成型将框架成型到安装基板上构造而成,防止了对部件和端子的粘附并减少了对安装基板的损坏。传感器组件包括图像传感器、安装有图像传感器的安装基板、以包围图像传感器的方式设置于安装基板的框架、以及以覆盖图像传感器的方式安装于框架的盖。安装基板包括与图像传感器电连接的端子以及在设置框架的区域与端子之间以预定深度设置的槽。
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MOUNTING SUBSTRATE MOUNTED WITH IMAGE SENSOR, SENSOR ASSEMBLY, AND METHOD OF MANUFACTURING THE SAME
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