Semiconductor device package

The invention relates to a semiconductor device package. In a general aspect, a semiconductor device can include a substrate and a positive power supply terminal electrically coupled with the substrate, the positive power supply terminal being arranged in a first plane. The device can also include a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IM SEUNG-WON, JEON O-SEOB, LEE BYOUNG-OK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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