SWING APPARATUS, METHOD FOR PROCESSING A SUBSTRATE, SWING MODULE FOR RECEIVING A SUBSTRATE FROM A TRANSFER CHAMBER, AND VACUUM PROCESSING SYSTEM

A swing apparatus for moving a substrate relative to one or more deposition sources having a longitudinal axis is described. The swing apparatus includes a support body for holding the substrate; a rotation mechanism coupled to the support body for moving the substrate by an angle around a rotationa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	REDDY LOKESHA, HOSOKAWA AKIHIRO, KIM KYUNG-TAE, SHANMUGAM SASIKUMAR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!