SEMICONDUCTOR INSPECTION APPARATUS

Provided is a semiconductor inspection apparatus capable of detecting an abnormality with high sensitivity during defect analysis of a micro device. The semiconductor inspection apparatus comprises: asample base 6 on which a sample is placed; an electronic optical system 1 which irradiates the sample with an electron beam; a measurement probe 3 to which the sample comes into contact; a measurement device 8 which measures an output from the measurement probe; and an information processing device 9 which acquires the measurement value of an output from the measurement probe in response to irradiation of the sample with the electron beam. The information processing device sets a timing for starting irradiation of the sample with the electron beam and a timing for freezing the irradiation with the electron beam, sets a first measurement time period during which the measurement device measures an output from the measurement probe in a state where the sample is being irradiated with the electron beam, sets a second