Multi-degree-of-freedom buffer quartz chip
The invention discloses a multi-degree-of-freedom buffer quartz chip, which comprises a sensitive unit, a carrying table, a first flexible support part, an isolation frame, a second flexible support part and a fixing block. A non-resonance part of the sensitive unit is connected with the carrying ta...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a multi-degree-of-freedom buffer quartz chip, which comprises a sensitive unit, a carrying table, a first flexible support part, an isolation frame, a second flexible support part and a fixing block. A non-resonance part of the sensitive unit is connected with the carrying table. The carrying table is connected with the inner side of the isolation frame through a first flexible supporting part, and the rigidity of the first flexible supporting part in the X and Y directions is smaller than that in the Z direction. The outer side of the isolation frame is connected withthe fixing block through a second flexible supporting part, and the rigidity of the second flexible supporting part in the Z direction is smaller than that in the X and Y directions. The fixing blockis used for supporting the quartz chip. The invention discloses a quartz chip structure with multi-degree-of-freedom buffer in X, Y and Z directions, which can effectively avoid the vibration energy dissipation of a sensitive |
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