CHIP SCALE PACKAGE LIGHT EMITTING DIODE MODULE FOR AUTOMOTIVE LIGHTING APPLICATIONS
LED modules for use in, for instance, automotive applications are provided. In one example implementation, the LED module can include a substrate. The LED module can include a plurality of chip-scalepackage LEDs. The plurality of chip-scale package LEDs can be arranged in a matrix on the substrate....
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| creator | ROHM SEBASTIAN TUSLER WOLFGANG ZIPPEL MARTIN |
| description | LED modules for use in, for instance, automotive applications are provided. In one example implementation, the LED module can include a substrate. The LED module can include a plurality of chip-scalepackage LEDs. The plurality of chip-scale package LEDs can be arranged in a matrix on the substrate. Each chip-scale package LED can have a light emitting area that is about80% or greater of a total area associated with the chip-scale package LED. Each chip-scale package LED can be separated from an adjacent chip-scale package LED by a gap. In some embodiments, a side coat material can be disposedin the gap.
提供了一种LED模块，例如用于汽车应用中。在一个示例实施方式中，LED模块可以包括基板。LED模块可以包括多个芯片级封装LED。多个芯片级封装LED可以矩阵形式布置在基板上。每个芯片级封装LED可以具有为与芯片级封装LED相关联的总区域的大约80％或更大的发光区域。每个芯片级封装LED可以与相邻的芯片级封装LED以一间隙分隔开。在一些实施例中，可以在间隙中布置侧涂层材料。 |
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提供了一种LED模块，例如用于汽车应用中。在一个示例实施方式中，LED模块可以包括基板。LED模块可以包括多个芯片级封装LED。多个芯片级封装LED可以矩阵形式布置在基板上。每个芯片级封装LED可以具有为与芯片级封装LED相关联的总区域的大约80％或更大的发光区域。每个芯片级封装LED可以与相邻的芯片级封装LED以一间隙分隔开。在一些实施例中，可以在间隙中布置侧涂层材料。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; NON-PORTABLE LIGHTING DEVICES ; SEMICONDUCTOR DEVICES ; SYSTEMS THEREOF ; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS ; WEAPONS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210122&DB=EPODOC&CC=CN&NR=112262470A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210122&DB=EPODOC&CC=CN&NR=112262470A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROHM SEBASTIAN</creatorcontrib><creatorcontrib>TUSLER WOLFGANG</creatorcontrib><creatorcontrib>ZIPPEL MARTIN</creatorcontrib><title>CHIP SCALE PACKAGE LIGHT EMITTING DIODE MODULE FOR AUTOMOTIVE LIGHTING APPLICATIONS</title><description>LED modules for use in, for instance, automotive applications are provided. In one example implementation, the LED module can include a substrate. The LED module can include a plurality of chip-scalepackage LEDs. The plurality of chip-scale package LEDs can be arranged in a matrix on the substrate. Each chip-scale package LED can have a light emitting area that is about80% or greater of a total area associated with the chip-scale package LED. Each chip-scale package LED can be separated from an adjacent chip-scale package LED by a gap. In some embodiments, a side coat material can be disposedin the gap.
提供了一种LED模块，例如用于汽车应用中。在一个示例实施方式中，LED模块可以包括基板。LED模块可以包括多个芯片级封装LED。多个芯片级封装LED可以矩阵形式布置在基板上。每个芯片级封装LED可以具有为与芯片级封装LED相关联的总区域的大约80％或更大的发光区域。每个芯片级封装LED可以与相邻的芯片级封装LED以一间隙分隔开。在一些实施例中，可以在间隙中布置侧涂层材料。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-PORTABLE LIGHTING DEVICES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SYSTEMS THEREOF</subject><subject>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyksKwjAQANBuXIh6h_EAgo1i10OSJoP5YaZuS5G4Ei3U-6NCD-Dqbd6yytJSgizRaUgoz2g0ODKWQXtipmBAUVQafFTd97TxAthx9JHpOtdfwpQcSWSKIa-rxX14TGUzu6q2rWZpd2V89WUah1t5lncvQ10LcRLHZo-Hf84H4iwvuQ</recordid><startdate>20210122</startdate><enddate>20210122</enddate><creator>ROHM SEBASTIAN</creator><creator>TUSLER WOLFGANG</creator><creator>ZIPPEL MARTIN</creator><scope>EVB</scope></search><sort><creationdate>20210122</creationdate><title>CHIP SCALE PACKAGE LIGHT EMITTING DIODE MODULE FOR AUTOMOTIVE LIGHTING APPLICATIONS</title><author>ROHM SEBASTIAN ; TUSLER WOLFGANG ; ZIPPEL MARTIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112262470A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-PORTABLE LIGHTING DEVICES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SYSTEMS THEREOF</topic><topic>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>ROHM SEBASTIAN</creatorcontrib><creatorcontrib>TUSLER WOLFGANG</creatorcontrib><creatorcontrib>ZIPPEL MARTIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROHM SEBASTIAN</au><au>TUSLER WOLFGANG</au><au>ZIPPEL MARTIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHIP SCALE PACKAGE LIGHT EMITTING DIODE MODULE FOR AUTOMOTIVE LIGHTING APPLICATIONS</title><date>2021-01-22</date><risdate>2021</risdate><abstract>LED modules for use in, for instance, automotive applications are provided. In one example implementation, the LED module can include a substrate. The LED module can include a plurality of chip-scalepackage LEDs. The plurality of chip-scale package LEDs can be arranged in a matrix on the substrate. Each chip-scale package LED can have a light emitting area that is about80% or greater of a total area associated with the chip-scale package LED. Each chip-scale package LED can be separated from an adjacent chip-scale package LED by a gap. In some embodiments, a side coat material can be disposedin the gap.
提供了一种LED模块，例如用于汽车应用中。在一个示例实施方式中，LED模块可以包括基板。LED模块可以包括多个芯片级封装LED。多个芯片级封装LED可以矩阵形式布置在基板上。每个芯片级封装LED可以具有为与芯片级封装LED相关联的总区域的大约80％或更大的发光区域。每个芯片级封装LED可以与相邻的芯片级封装LED以一间隙分隔开。在一些实施例中，可以在间隙中布置侧涂层材料。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES SEMICONDUCTOR DEVICES SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS |
| title | CHIP SCALE PACKAGE LIGHT EMITTING DIODE MODULE FOR AUTOMOTIVE LIGHTING APPLICATIONS |
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