POWER MODULE COMPRISING A SUPPORTING COOLING BODY

The invention relates to a medium-voltage and high-voltage converter (2), preferably a modular multilevel converter, and a power module (1) comprising at least one power semiconductor module (4), at least one energy storage module (5), and at least one cooling device (6), wherein the cooling device (6) is embodied as a cooling plate (7) through which a coolant, particularly a cooling liquid, can flow, said cooling plate having a smaller cooling plate thickness (10) compared to a cooling plate length (8) and a cooling plate height (9), and the cooling plate (7) comprises at least one protectiveregion (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or part of the cooling plate height (9) of the cooling plate (7), for the load transfer of the power module (1) to a frame (3) of the medium-voltage or high-voltage converter (2). 本发明涉及一种中压或高压变流器(2)、优选模块化多级变流器以及一种功率结构组件(1)，所述功率结构组件包括至少一个功率半导体结构组件(4)、至少一个蓄能器结构组件(5)、至少一个冷却装置(6)，并且所述冷却装置(6)构造为由冷却剂可流经的、特别是由冷却液可流过的冷却板(7)，所述冷却板具有与冷却板长度