Package Lead Design with Grooves for Improved Dambar Separation

The invention relates to a package lead design with grooves for improved dambar separation. The lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHONG MENG HOW, TAN KAI YANG, NARAYANASAMY JAYAGANASAN, LAM CHEE MING, MURUGAN SANJAY KUMAR, NAVARETNASINGGAM ARIVINDRAN, WANG LEE SHUANG, HOLGADO ELMER SENORIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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